Inventor

STRADER JASON L

US39 patents

⚠️ This page may combine multiple inventors who share the name “STRADER JASON L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STRADER JASON L

LAIRD TECHNOLOGIES INC

Material having an edge shape

Material having edging

Methods for establishing thermal joints between heat spreaders or lids and heat sources

Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding

Thermal interface material assemblies and related methods

Material having edging

Thermal interface materials with thin film or metallization

Thermal interface materials including thermally reversible gels

Systems of applying materials to components

Thermal management assemblies suitable for use with transceivers and other devices

Thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powder

Material having edge shape

Methods for establishing thermal joints between heat spreaders or lids and heat sources

Methods for establishing thermal joints between heat spreaders or lids and heat sources

Small form-factor pluggable (SFP) transceivers

Methods for establishing thermal joints between heat spreaders or lids and heat sources

Thermal interface materials with reinforcement for abrasion resistance and/or suitable for use between sliding components

Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding

Thermal interface materials

Materials including thermally reversible gels

Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide

Thermally-conductive electromagnetic interference (EMI) absorbers including aluminum powder

Thermal management and/or EMI mitigation materials including coated fillers

Methods for establishing thermal joints between heat spreaders or lids and heat sources

Thermal management and/or EMI mitigation materials including coated fillers

System for applying interface materials

Edging for materials

Devices for absorbing energy from electronic components

Board level shields and systems and methods of applying board level shielding

Devices for absorbing energy from electronic components

Systems of applying materials to components

Thermally-conductive electromagnetic interference (EMI) absorbers with silicon carbide

Highly compliant non-silicone putties and thermal interface materials including the same

Thermal interface materials including memory foam cores

Methods of applying thermal interface materials to board level shields

THERMAGON INC

Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink

Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink

STRADER JASON L

Thermal interface material with thin transfer film or metallization

Thermal interface material assemblies, and related methods