Inventor
FUJISAWA SACHIKO
JP6 patents
Patents
6 patentsUS11948900B2Apr 2, 2024
Bonded body, circuit board, and semiconductor device
TOSHIBA KK2 citations71
US12431406B2Sep 30, 2025
Bonded body, circuit board, semiconductor device, and method for manufacturing bonded body
TOSHIBA KK1 citations62
US12160959B2Dec 3, 2024
Bonded body, ceramic copper circuit board, method for manufacturing bonded body, and method for manufacturing ceramic copper circuit board
TOSHIBA KK0 citations61
US12343820B2Jul 1, 2025
Brazing material, bonded body, ceramic circuit board, and method for manufacturing bonded body
TOSHIBA KK0 citations50
US12347744B2Jul 1, 2025
Bonded body including titanium alloy at bonding boundary
TOSHIBA KK0 citations50
US12115603B2Oct 15, 2024
Bonded body, ceramic copper circuit substrate, and semiconductor device
TOSHIBA KK0 citations50