Inventor
KONDA MASASHI
JP7 patents
Patents
7 patentsUS5687901ANov 18, 1997
Process and apparatus for forming ball bumps
NIPPON STEEL CORP54 citations93
US5362984ANov 8, 1994
Semiconductor device with jumping wire
NIPPON STEEL CORP24 citations92
US5857610AJan 12, 1999
Process and apparatus for forming ball bumps
NIPPON STEEL CORP22 citations89
US5150198ASep 22, 1992
Radiator for semiconductor chip
NIPPON STEEL CORP13 citations72
US5803339ASep 8, 1998
Process and apparatus for forming ball bumps
NIPPON STEEL CORP9 citations71
US5137479AAug 11, 1992
Lead structure for packaging semiconductor chip
NIPPON STEEL CORP12 citations71
US5114878AMay 19, 1992
Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same
NIPPON STEEL CORP6 citations60