P

Inventor

KOBAYASHI FUMIYUKI

JP73 patents
⚠️ This page may combine multiple inventors who share the name “KOBAYASHI FUMIYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI LTD

28 patents
US5281151AJan 25, 1994

Semiconductor chip carrier, module having same chip carrier mounted therein, and electronic device incorporating same module

HITACHI LTD261 citations99
US5077601ADec 31, 1991

Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system

HITACHI LTD204 citations99
US5592363AJan 7, 1997

Electronic apparatus

HITACHI LTD228 citations98
US4825284AApr 25, 1989

Semiconductor resin package structure

HITACHI LTD179 citations97
US5751062AMay 12, 1998

Cooling device of multi-chip module

HITACHI LTD75 citations96
US5276289AJan 4, 1994

Electronic circuit device and method of producing the same

HITACHI LTD57 citations96
US5089936AFeb 18, 1992

Semiconductor module

HITACHI LTD64 citations96
US4970575ANov 13, 1990

Semiconductor device

HITACHI LTD98 citations96
US4770242ASep 13, 1988

Cooling device of semiconductor chips

HITACHI LTD96 citations96
US4739444AApr 19, 1988

Device for adjusting pressure loss of cooling air for an assembly of cards carrying electronic components

HITACHI LTD112 citations96
US4649990AMar 17, 1987

Heat-conducting cooling module

HITACHI LTD75 citations96
US4558395ADec 10, 1985

Cooling module for integrated circuit chips

HITACHI LTD97 citations96
US5109317AApr 28, 1992

Mounting mechanism for mounting heat sink on multi-chip module

HITACHI LTD80 citations95
US5276586AJan 4, 1994

Bonding structure of thermal conductive members for a multi-chip module

HITACHI LTD69 citations94
US4837663AJun 6, 1989

Electronic apparatus cooling system

HITACHI LTD100 citations94
US5350886ASep 27, 1994

Mounting substrate

HITACHI LTD28 citations93
US5731066AMar 24, 1998

Electronic circuit device

HITACHI LTD38 citations92
USRE35721EFeb 3, 1998

Cooling device of semiconductor chips

HITACHI LTD33 citations92
US4651192AMar 17, 1987

Ceramic packaged semiconductor device

HITACHI LTD40 citations92
US4624896ANov 25, 1986

Multi-layer ceramic substrate and method for the production thereof

HITACHI LTD33 citations92
US5707749AJan 13, 1998

Method for producing thin film multilayer wiring board

HITACHI LTD31 citations91
US5133403AJul 28, 1992

Cooling arrangement for semiconductor devices and method of making the same

HITACHI LTD44 citations91
US5277723AJan 11, 1994

Method for producing multilayer ceramic body with convex side faces

HITACHI LTD48 citations90
US4739125AApr 19, 1988

Electric component part having lead terminals

HITACHI LTD27 citations90
US4731703AMar 15, 1988

Power supply structure and system for mounting the same

HITACHI LTD24 citations81
US4616292AOct 7, 1986

Multilayer printed circuit board

HITACHI LTD19 citations80
US4884170ANov 28, 1989

Multilayer printed circuit board and method of producing the same

HITACHI LTD22 citations79
US4836434AJun 6, 1989

Method and apparatus for airtightly packaging semiconductor package

HITACHI LTD18 citations74

NEC CORP

14 patents

SHARP KK

6 patents

MURATA MANUFACTURING CO

2 patents

Showing the top 50 of 73 patents by PatentIndex Score.