Inventor
LIU HERMEN
TW15 patents
Patents
15 patentsUS6455943B1Sep 24, 2002
Bonding pad structure of semiconductor device having improved bondability
UNITED MICROELECTRONICS CORP51 citations95
US6316727B1Nov 13, 2001
Multi-chip semiconductor package
UNITED MICROELECTRONICS CORP67 citations95
US6297561B1Oct 2, 2001
Semiconductor chip
UNITED MICROELECTRONICS CORP25 citations92
US6251694B1Jun 26, 2001
Method of testing and packaging a semiconductor chip
UNITED MICROELECTRONICS CORP34 citations92
US6228689B1May 8, 2001
Trench style bump and application of the same
UNITED MICROELECTRONICS CORP40 citations92
US7170167B2Jan 30, 2007
Method for manufacturing wafer level chip scale package structure
UNITED MICROELECTRONICS CORP8 citations73
US6664142B2Dec 16, 2003
Laser repair operation
UNITED MICROELECTRONICS CORP8 citations73
US6424025B1Jul 23, 2002
Cross grid array package structure and method of manufacture
UNITED MICROELECTRONICS CORP10 citations73
US6190938B1Feb 20, 2001
Cross grid array package structure and method of manufacture
UNITED MICROELECTRONICS CORP12 citations73
US6121063ASep 19, 2000
Method of testing a ball grid array IC
UNITED MICROELECTRONICS CORP7 citations65
US7211500B2May 1, 2007
Pre-process before cutting a wafer and method of cutting a wafer
UNITED MICROELECTRONICS CORP6 citations62
US6794606B2Sep 21, 2004
Laser repair operation
UNITED MICROELECTRONICS CORP3 citations62
US6667195B2Dec 23, 2003
Laser repair operation
UNITED MICROELECTRONICS CORP4 citations62
US6388326B2May 14, 2002
Bonding pad on a semiconductor chip
UNITED MICROELECTRONICS CORP2 citations62
US6372621B1Apr 16, 2002
Method of forming a bonding pad on a semiconductor chip
UNITED MICROELECTRONICS CORP0 citations52