Inventor
VITALI BATTISTA
IT5 patents
Patents
5 patentsUS6260753B1Jul 17, 2001
Gold bumps bonding on connection pads and subsequent coining of their vertex
ST MICROELECTRONICS SRL26 citations84
US10872845B2Dec 22, 2020
Process for manufacturing a flip chip semiconductor package and a corresponding flip chip package
ST MICROELECTRONICS SRL2 citations69
US6581816B2Jun 24, 2003
Capillary for bonding copper wires between a semiconductor circuit chip and a corresponding terminal connector of a semiconductor device
ST MICROELECTRONICS SRL11 citations64
US10741415B2Aug 11, 2020
Thermosonically bonded connection for flip chip packages
ST MICROELECTRONICS SRL0 citations48
US10141197B2Nov 27, 2018
Thermosonically bonded connection for flip chip packages
ST MICROELECTRONICS SRL1 citations48