Inventor
MURPHY JAMES J
US22 patents
⚠️ This page may combine multiple inventors who share the name “MURPHY JAMES J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FAIRCHILD SEMICONDUCTOR
9 patentsUS6444528B1Sep 3, 2002
Selective oxide deposition in the bottom of a trench
FAIRCHILD SEMICONDUCTOR99 citations98
US6437386B1Aug 20, 2002
Method for creating thick oxide on the bottom surface of a trench structure in silicon
FAIRCHILD SEMICONDUCTOR59 citations93
US7936009B2May 3, 2011
Shielded gate trench FET with an inter-electrode dielectric having a low-k dielectric therein
FAIRCHILD SEMICONDUCTOR35 citations92
US6861296B2Mar 1, 2005
Method for creating thick oxide on the bottom surface of a trench structure in silicon
FAIRCHILD SEMICONDUCTOR36 citations89
US7768075B2Aug 3, 2010
Semiconductor die packages using thin dies and metal substrates
FAIRCHILD SEMICONDUCTOR12 citations82
US7960800B2Jun 14, 2011
Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same
FAIRCHILD SEMICONDUCTOR5 citations72
US8343852B2Jan 1, 2013
Method and structure for dividing a substrate into individual devices
FAIRCHILD SEMICONDUCTOR2 citations60
US7956411B2Jun 7, 2011
High aspect ratio trench structures with void-free fill material
FAIRCHILD SEMICONDUCTOR2 citations60
US7951688B2May 31, 2011
Method and structure for dividing a substrate into individual devices
FAIRCHILD SEMICONDUCTOR1 citations50
CHALLA ASHOK
2 patentsGRUENHAGEN MICHAEL D
2 patentsUS8058732B2Nov 15, 2011
Semiconductor die structures for wafer-level chipscale packaging of power devices, packages and systems for using the same, and methods of making the same
GRUENHAGEN MICHAEL D10 citations81
US8598035B2Dec 3, 2013
Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same
GRUENHAGEN MICHAEL D3 citations60