Inventor
YEH YUNG-I
TW32 patents
⚠️ This page may combine multiple inventors who share the name “YEH YUNG-I”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
31 patentsUS6528882B2Mar 4, 2003
Thermal enhanced ball grid array package
ADVANCED SEMICONDUCTOR ENG151 citations98
US6423622B1Jul 23, 2002
Lead-bond type chip package and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG40 citations92
US6291898B1Sep 18, 2001
Ball grid array package
ADVANCED SEMICONDUCTOR ENG62 citations92
US6751781B2Jun 15, 2004
Thermal data automatic service system
ADVANCED SEMICONDUCTOR ENG49 citations89
US6489682B1Dec 3, 2002
Ball grid array semiconductor package and substrate therefor
ADVANCED SEMICONDUCTOR ENG34 citations87
US10593630B2Mar 17, 2020
Semiconductor package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG8 citations83
US9960137B1May 1, 2018
Semiconductor device package and method for forming the same
ADVANCED SEMICONDUCTOR ENG11 citations83
US9484313B2Nov 1, 2016
Semiconductor packages with thermal-enhanced conformal shielding and related methods
ADVANCED SEMICONDUCTOR ENG10 citations81
US7375020B2May 20, 2008
Method of forming bumps
ADVANCED SEMICONDUCTOR ENG6 citations74
US6916732B2Jul 12, 2005
Method of forming bumps
ADVANCED SEMICONDUCTOR ENG11 citations74
US11224132B2Jan 11, 2022
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations72
US11139252B2Oct 5, 2021
Semiconductor package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations72
US10797022B2Oct 6, 2020
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations72
US6313413B1Nov 6, 2001
Wire structure of substrate for layout detection
ADVANCED SEMICONDUCTOR ENG7 citations72
US5982625ANov 9, 1999
Semiconductor packaging device
ADVANCED SEMICONDUCTOR ENG15 citations71
US9984983B2May 29, 2018
Semiconductor packages with thermal-enhanced conformal shielding and related methods
ADVANCED SEMICONDUCTOR ENG5 citations70
US12364008B2Jul 15, 2025
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations63
US6960822B2Nov 1, 2005
Solder mask and structure of a substrate
ADVANCED SEMICONDUCTOR ENG5 citations63
US6551855B1Apr 22, 2003
Substrate strip and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG5 citations63
US12218077B2Feb 4, 2025
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG0 citations62
US12089349B2Sep 10, 2024
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US11997888B2May 28, 2024
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations62
US11744024B2Aug 29, 2023
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US11437415B2Sep 6, 2022
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US11201200B2Dec 14, 2021
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US11081473B2Aug 3, 2021
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US6642612B2Nov 4, 2003
Lead-bond type chip package and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG4 citations62
US12572170B2Mar 10, 2026
Electronic device with removable electronic component modules
ADVANCED SEMICONDUCTOR ENG0 citations58
US6795746B2Sep 21, 2004
System for providing IC bonding diagram via network
ADVANCED SEMICONDUCTOR ENG3 citations58
US6252309B1Jun 26, 2001
Packaged semiconductor substrate
ADVANCED SEMICONDUCTOR ENG0 citations50
US7061084B2Jun 13, 2006
Lead-bond type chip package and manufacturing method thereof
ADVANCED SEMICONDUCTOR ENG0 citations41