Inventor
MATSUI YUKITERU
JP55 patents
⚠️ This page may combine multiple inventors who share the name “MATSUI YUKITERU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
29 patentsUS6740590B1May 25, 2004
Aqueous dispersion, aqueous dispersion for chemical mechanical polishing used for manufacture of semiconductor devices, method for manufacture of semiconductor devices, and method for formation of embedded writing
TOSHIBA KK102 citations98
US6454819B1Sep 24, 2002
Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor device
TOSHIBA KK108 citations98
US6375545B1Apr 23, 2002
Chemical mechanical method of polishing wafer surfaces
TOSHIBA KK131 citations98
US7166017B2Jan 23, 2007
Slurry for CMP, polishing method and method of manufacturing semiconductor device
TOSHIBA KK23 citations93
US6858539B2Feb 22, 2005
Post-CMP treating liquid and method for manufacturing semiconductor device
TOSHIBA KK24 citations93
US6794285B2Sep 21, 2004
Slurry for CMP, and method of manufacturing semiconductor device
TOSHIBA KK19 citations93
US6935928B2Aug 30, 2005
Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
TOSHIBA KK24 citations92
US6576554B2Jun 10, 2003
Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP process
TOSHIBA KK25 citations92
US7332104B2Feb 19, 2008
Slurry for CMP, polishing method and method of manufacturing semiconductor device
TOSHIBA KK15 citations84
US7071108B2Jul 4, 2006
Chemical mechanical polishing slurry containing abrasive particles exhibiting photocatalytic function
TOSHIBA KK15 citations84
US7402521B2Jul 22, 2008
Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor
TOSHIBA KK8 citations74
US7060621B2Jun 13, 2006
Slurry for CMP, polishing method and method of manufacturing semiconductor device
TOSHIBA KK8 citations74
US8871644B2Oct 28, 2014
Method of manufacturing semiconductor device
TOSHIBA KK4 citations73
US7435682B2Oct 14, 2008
Method of manufacturing semiconductor device
TOSHIBA KK8 citations72
US7833431B2Nov 16, 2010
Aqueous dispersion for CMP, polishing method and method for manufacturing semiconductor device
TOSHIBA KK3 citations63
US7700489B2Apr 20, 2010
Method of manufacturing a semiconductor device
TOSHIBA KK4 citations63
US7459398B2Dec 2, 2008
Slurry for CMP, polishing method and method of manufacturing semiconductor device
TOSHIBA KK6 citations63
US7452819B2Nov 18, 2008
Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device
TOSHIBA KK3 citations63
US7416942B2Aug 26, 2008
Method for manufacturing semiconductor device
TOSHIBA KK5 citations63
US7186654B2Mar 6, 2007
Chemical mechanical polishing slurry and method of manufacturing semiconductor device by using the same
TOSHIBA KK3 citations63
US6875088B2Apr 5, 2005
Polishing member and method of manufacturing semiconductor device
TOSHIBA KK4 citations63
US9144879B2Sep 29, 2015
Planarization method and planarization apparatus
TOSHIBA KK3 citations61
US7829406B2Nov 9, 2010
Method of manufacturing semiconductor device
TOSHIBA KK2 citations58
US8754433B2Jun 17, 2014
Semiconductor device and method of manufacturing the same
TOSHIBA KK0 citations52
US7888139B2Feb 15, 2011
Fabricating method of nonvolatile semiconductor storage apparatus
TOSHIBA KK0 citations52
US7052620B2May 30, 2006
Polishing slurry for aluminum-based metal, and method of manufacturing semiconductor device
TOSHIBA KK0 citations52
US9558961B2Jan 31, 2017
Manufacturing method of semiconductor device
TOSHIBA KK0 citations51
US9174322B2Nov 3, 2015
Manufacturing method of semiconductor device
TOSHIBA KK0 citations51
US9012246B2Apr 21, 2015
Manufacturing method of semiconductor device and polishing apparatus
TOSHIBA KK0 citations51
TOSHIBA MEMORY CORP
9 patentsUS10850363B2Dec 1, 2020
Manufacturing method of semiconductor device and semiconductor manufacturing apparatus
TOSHIBA MEMORY CORP3 citations72
US9837279B2Dec 5, 2017
Manufacturing method of semiconductor device and semiconductor device manufacturing apparatus
TOSHIBA MEMORY CORP3 citations72
US10991588B2Apr 27, 2021
Manufacturing method of semiconductor device and semiconductor device manufacturing apparatus
TOSHIBA MEMORY CORP0 citations62
US10195716B2Feb 5, 2019
Dresser, method of manufacturing dresser, and method of manufacturing semiconductor device
TOSHIBA MEMORY CORP1 citations62
US10998283B2May 4, 2021
Semiconductor device production method
TOSHIBA MEMORY CORP0 citations51
US10283383B2May 7, 2019
Planarization method and planarization apparatus
TOSHIBA MEMORY CORP0 citations51
US10121677B2Nov 6, 2018
Manufacturing method of semiconductor device
TOSHIBA MEMORY CORP1 citations51
US10079153B2Sep 18, 2018
Semiconductor storage device
TOSHIBA MEMORY CORP0 citations51
US10010997B2Jul 3, 2018
Abrasive cloth and polishing method
TOSHIBA MEMORY CORP0 citations49
KIOXIA CORP
4 patentsUS11883926B2Jan 30, 2024
Polishing pad, semiconductor fabricating device and fabricating method of semiconductor device
KIOXIA CORP0 citations62
US11534886B2Dec 27, 2022
Polishing device, polishing head, polishing method, and method of manufacturing semiconductor device
KIOXIA CORP0 citations59
US10985027B2Apr 20, 2021
Method for manufacturing semiconductor device
KIOXIA CORP0 citations59
US12300499B2May 13, 2025
Polishing solution, polishing apparatus, and polishing method
KIOXIA CORP0 citations58
MATSUI YUKITERU
2 patentsMINAMIHABA GAKU
2 patentsKODERA MASAKO
1 patentSHIDA HIROTAKA
1 patentGAWASE AKIFUMI
1 patentEDA HAJIME
1 patentShowing the top 50 of 55 patents by PatentIndex Score.