Inventor

TAKAGI HIDEKI

JP20 patents

⚠️ This page may combine multiple inventors who share the name “TAKAGI HIDEKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAKAGI HIDEKI

AIST

Method for forming micropattern of polyimide using imprinting

Composite having diamond crystal base

Plasma source, and atomic clock employing plasma source

GOTO TAKAYUKI

Room-temperature bonding method and room-temperature bonding apparatus including sputtering

Room temperature bonding using sputtering

MITSUBISHI HEAVY IND MACHINE TOOL CO LTD

Room temperature bonding apparatus and room temperature bonding method

Device manufactured by room-temperature bonding, device manufacturing method, and room-temperature bonding apparatus

AGENCY IND SCIENCE TECHN

Method of forming film of ultrafine particles

FUJITSU MEDIA DEVICES LTD

Method and manufacturing surface acoustic wave device

AIR LIQUIDE

Process for assembling piping or components by TIG welding

TAKAGI HIDEKI

Method of molding glass parts and molding apparatus

IBIDEN CO LTD

Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer

NAT INST ADVANCED IND SCIENCE & TECH

Package formation method and MEMS package

KASHIMA YUKIO

Light emitting element and method for manufacturing same

OKI ELECTRIC IND CO LTD

IC package capable of accommodating discrete devices

TOYOTA JIDOSHOKKI KK

Manufacturing method for semiconductor substrate

MARUBUN CO LTD

Semiconductor light emitting element and method for producing the same

SANYO ELECTRIC CO

Electronic component mounting package and package assembled substrate

YAMADA HISASHI

Semiconductor substrate, field-effect transistor, integrated circuit, and method for fabricating semiconductor substrate

UTSUMI JUN

Manufcaturing method for room-temperature substrate bonding