P

Inventor

WAGNER MARK I

US11 patents
⚠️ This page may combine multiple inventors who share the name “WAGNER MARK I”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICELL TECHNOLOGIES INC

6 patents
US6905555B2Jun 14, 2005

Methods for transferring supercritical fluids in microelectronic and other industrial processes

MICELL TECHNOLOGIES INC78 citations97
US6669785B2Dec 30, 2003

Methods and compositions for etch cleaning microelectronic substrates in carbon dioxide

MICELL TECHNOLOGIES INC102 citations97
US6953041B2Oct 11, 2005

Compositions of transition metal species in dense phase carbon dioxide and methods of use thereof

MICELL TECHNOLOGIES INC15 citations84
US7141496B2Nov 28, 2006

Method of treating microelectronic substrates

MICELL TECHNOLOGIES INC7 citations73
US6989172B2Jan 24, 2006

Method of coating microelectronic substrates

MICELL TECHNOLOGIES INC10 citations73
US7592035B2Sep 22, 2009

Method of coating microelectronic substrates

MICELL TECHNOLOGIES INC0 citations51

WAGNER MARK I

2 patents
US9620410B1Apr 11, 2017

Methods for preventing precipitation of etch byproducts during an etch process and/or subsequent rinse process

WAGNER MARK I1 citations48
US8961701B2Feb 24, 2015

Method and system of drying a microelectronic topography

WAGNER MARK I1 citations48

3M INNOVATIVE PROPERTIES CO

1 patent
US6355735B1Mar 12, 2002

Semi-interpenetrating polymer network from epoxy monomer and olefin

3M INNOVATIVE PROPERTIES CO8 citations65

NIXON RONDA K

1 patent
US9004086B2Apr 14, 2015

Methods and apparatus for displacing fluids from substrates using supercritical CO2

NIXON RONDA K4 citations59

DEYOUNG JAMES P

1 patent
US8153533B2Apr 10, 2012

Methods and systems for preventing feature collapse during microelectronic topography fabrication

DEYOUNG JAMES P3 citations56