Inventor
ROSSER STEVEN G
US8 patents
⚠️ This page may combine multiple inventors who share the name “ROSSER STEVEN G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
4 patentsUS6747331B2Jun 8, 2004
Method and packaging structure for optimizing warpage of flip chip organic packages
IBM13 citations83
US6977345B2Dec 20, 2005
Vents with signal image for signal return path
IBM6 citations71
US7026706B2Apr 11, 2006
Method and packaging structure for optimizing warpage of flip chip organic packages
IBM3 citations62
US7351917B2Apr 1, 2008
Vents with signal image for signal return path
IBM2 citations60
ENDICOTT INTERCONNECT TECH INC
3 patentsUS7294791B2Nov 13, 2007
Circuitized substrate with improved impedance control circuitry, method of making same, electrical assembly and information handling system utilizing same
ENDICOTT INTERCONNECT TECH INC30 citations89
US7791897B2Sep 7, 2010
Multi-layer embedded capacitance and resistance substrate core
ENDICOTT INTERCONNECT TECH INC15 citations84
US7589283B2Sep 15, 2009
Method of making circuitized substrate with improved impedance control circuitry, electrical assembly and information handling system
ENDICOTT INTERCONNECT TECH INC12 citations81