Inventor
PALANISAMY PONNUSAMY
US31 patents
⚠️ This page may combine multiple inventors who share the name “PALANISAMY PONNUSAMY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DELCO ELECTRONICS CORP
14 patentsUS4939022AJul 3, 1990
Electrical conductors
DELCO ELECTRONICS CORP56 citations96
US4797605AJan 10, 1989
Moisture sensor and method of fabrication thereof
DELCO ELECTRONICS CORP60 citations96
US5395679AMar 7, 1995
Ultra-thick thick films for thermal management and current carrying capabilities in hybrid circuits
DELCO ELECTRONICS CORP65 citations94
US5176853AJan 5, 1993
Controlled adhesion conductor
DELCO ELECTRONICS CORP33 citations92
US5151777ASep 29, 1992
Interface device for thermally coupling an integrated circuit to a heat sink
DELCO ELECTRONICS CORP61 citations92
US5121298AJun 9, 1992
Controlled adhesion conductor
DELCO ELECTRONICS CORP49 citations92
US4970122ANov 13, 1990
Moisture sensor and method of fabrication thereof
DELCO ELECTRONICS CORP27 citations92
US4847003AJul 11, 1989
Electrical conductors
DELCO ELECTRONICS CORP22 citations82
US4846869AJul 11, 1989
Method of fabrication a curved glass sheet with a conductive oxide coating
DELCO ELECTRONICS CORP20 citations82
US5122929AJun 16, 1992
Method of achieving selective inhibition and control of adhesion in thick-film conductors
DELCO ELECTRONICS CORP19 citations81
US5169679ADec 8, 1992
Post-termination apparatus and process for thick film resistors of printed circuit boards
DELCO ELECTRONICS CORP8 citations74
US5164698ANov 17, 1992
Post-termination apparatus and process for thick film resistors of printed circuit boards
DELCO ELECTRONICS CORP10 citations74
US4959751ASep 25, 1990
Ceramic hybrid integrated circuit having surface mount device solder stress reduction
DELCO ELECTRONICS CORP10 citations73
US4819056AApr 4, 1989
Hybrid thick film circuit device
DELCO ELECTRONICS CORP5 citations63
SARNOFF CORP
8 patentsUS7003127B1Feb 21, 2006
Hearing aid with large diaphragm microphone element including a printed circuit board
SARNOFF CORP155 citations98
US7221768B2May 22, 2007
Hearing aid with large diaphragm microphone element including a printed circuit board
SARNOFF CORP54 citations96
US7592276B2Sep 22, 2009
Woven electronic textile, yarn and article
SARNOFF CORP133 citations95
US6939737B2Sep 6, 2005
Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
SARNOFF CORP19 citations92
US6849935B2Feb 1, 2005
Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
SARNOFF CORP14 citations92
US6653009B2Nov 25, 2003
Solid oxide fuel cells and interconnectors
SARNOFF CORP47 citations92
US6366678B1Apr 2, 2002
Microphone assembly for hearing aid with JFET flip-chip buffer
SARNOFF CORP37 citations88
US6914379B2Jul 5, 2005
Thermal management in electronic displays
SARNOFF CORP1 citations52
INTEL CORP
5 patentsUS6743069B2Jun 1, 2004
Facilitating the spread of encapsulant between surfaces of electronic devices
INTEL CORP7 citations74
US6527159B2Mar 4, 2003
Surface mounting to an irregular surface
INTEL CORP6 citations73
US6706556B2Mar 16, 2004
Making interconnections to a non-flat surface
INTEL CORP2 citations60
US6512301B1Jan 28, 2003
Making interconnections to a non-flat surface
INTEL CORP3 citations60
US7002562B2Feb 21, 2006
Interconnecting large area display panels
INTEL CORP0 citations52