Inventor
SHAN LEI
US18 patents
⚠️ This page may combine multiple inventors who share the name “SHAN LEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
11 patentsUS6992255B2Jan 31, 2006
Via and via landing structures for smoothing transitions in multi-layer substrates
IBM13 citations79
US11062976B2Jul 13, 2021
Functional stiffener that enables land grid array interconnections and power decoupling
IBM0 citations62
US10892105B2Jan 12, 2021
Multi-layer capacitor package
IBM0 citations61
US7537487B2May 26, 2009
Crosstalk reduction in dual inline memory module (DIMM) connectors
IBM3 citations61
US7407415B2Aug 5, 2008
Crosstalk reduction in dual inline memory module (DIMM) connectors
IBM3 citations61
US12170252B2Dec 17, 2024
Electronic substrate stacking
IBM0 citations51
US6940165B2Sep 6, 2005
Impedance matched electrical interconnect using dielectric compounds
IBM1 citations51
US10701797B2Jun 30, 2020
Embedding discrete components having variable dimensions in a substrate
IBM0 citations50
US10170249B2Jan 1, 2019
Multi-layer capacitor package
IBM0 citations50
US9986633B2May 29, 2018
Embedding discrete components having variable dimensions in a substrate
IBM1 citations50
US9872392B2Jan 16, 2018
Power decoupling attachment
IBM1 citations50
SHANXI ZHENDONG PILOT BIOLOG SCIENCE AND TECHNOLOGY CO LTD
2 patentsUS9303006B2Apr 5, 2016
Line leaf inula flower lactone A and methods for preparing and using the same for treating myocarditis
SHANXI ZHENDONG PILOT BIOLOG SCIENCE AND TECHNOLOGY CO LTD1 citations41
US9278948B2Mar 8, 2016
Line leaf inula flower lactone A and methods for preparing and using the same for treating multiple sclerosis
SHANXI ZHENDONG PILOT BIOLOG SCIENCE AND TECHNOLOGY CO LTD1 citations41