Inventor

YIEH ELLIE

US90 patents

⚠️ This page may combine multiple inventors who share the name “YIEH ELLIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YIEH ELLIE

APPLIED MATERIALS INC

Post-deposition treatment to enhance properties of Si-O-C low k films

Methods and apparatus to enhance properties of Si-O-C low K films

Process for forming a low dielectric constant carbon-containing film

Method of decreasing the K value in SiOC layer deposited by chemical vapor deposition

Method of depositing low k films using an oxidizing plasma

Multistep chamber cleaning and film deposition process using a remote plasma that also enhances film gap fill

Dual frequency plasma enhanced chemical vapor deposition of silicon carbide layers

Formation of a liquid-like silica layer by reaction of an organosilicon compound and a hydroxyl forming compound

Methods and apparatus for gettering fluorine from chamber material surfaces

Methods for shallow trench isolation

Lid assembly for a process chamber employing asymmetric flow geometries

Methods for depositing premetal dielectric layer at sub-atmospheric and high temperature conditions

Method and apparatus for gettering fluorine from chamber material surfaces

Methods and apparatus for cleaning surfaces in a substrate processing system

Process chamber for etching low K and other dielectric films

High quality silicon oxide films by remote plasma CVD from disilane precursors

Method of depositing dielectric films

Thermal CVD process for depositing a low dielectric constant carbon-doped silicon oxide film

Method for cleaning a process chamber

CVD plasma assisted lower dielectric constant sicoh film

Post-deposition treatment to enhance properties of Si-O-C low K films

Surface treatment of C-doped SiO2 film to enhance film stability during O2 ashing

Method of reducing undesired etching of insulation due to elevated boron concentrations

Methods and apparatus for shallow trench isolation

Deposition resistant lining for CVD chamber

Methods and apparatus for forming ultra-shallow doped regions using doped silicon oxide films

Method of depositing dielectric materials in damascene applications

Accelerated plasma clean

Surface treatment of c-doped SiO2 film to enhance film stability during O2 ashing

Method of depositing organosilicate layers

Methods and apparatus for depositing premetal dielectric layer at sub-atmospheric and high temperature conditions

Dielectric film deposition employing a bistertiarybutylaminesilane precursor

Method for forming low compressive stress fluorinated ozone/TEOS oxide film

Two-step borophosphosilicate glass deposition process and related devices and apparatus

Methods and apparatus for forming ultra-shallow doped regions using doped silicon oxide films

Method for depositing ozone/TEOS silicon oxide films of reduced surface sensitivity

Memory cell having stressed layers

Method of depositing organosillicate layers

Sub-atmospheric chemical vapor deposition system with dopant bypass

Dielectric film deposition employing a bistertiarybutylaminesilane precursor

Method and apparatus for tuning a process recipe to target dopant concentrations in a doped layer

Method of depositing low k films

Method of forming a low-K dual damascene interconnect structure

Method and apparatus for deposition of low dielectric constant materials

Post-deposition treatment to enhance properties of Si-O-C low films

Use of cyclic siloxanes for hardness improvement of low k dielectric films

Method of depositing low K films

MALLICK ABHIJIT BASU

High quality silicon oxide films by remote plasma CVD from disilane precursors

XIA LI-QUN

Post-deposition treatment to enhance properties of Si-O-C low K films

LUBOMIRSKY DMITRY

Dielectric deposition and etch back processes for bottom up gapfill