Inventor
WU BAN-LI
TW21 patents
Patents
21 patentsUS11004786B2May 11, 2021
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations86
US10832985B2Nov 10, 2020
Sensor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations85
US11929318B2Mar 12, 2024
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11742254B2Aug 29, 2023
Sensor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11374136B2Jun 28, 2022
Semiconductor package and forming method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10840227B2Nov 17, 2020
Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US12261092B2Mar 25, 2025
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations64
US12557707B2Feb 17, 2026
Method of fabricating package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12362274B2Jul 15, 2025
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12334434B2Jun 17, 2025
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12205860B2Jan 21, 2025
Sensor packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12015017B2Jun 18, 2024
Package structure, package-on-package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11855232B2Dec 26, 2023
Semiconductor package and forming method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11631658B2Apr 18, 2023
Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11527525B2Dec 13, 2022
Semiconductor device with multiple polarity groups
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11049850B2Jun 29, 2021
Methods of bonding the strip-shaped under bump metallization structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11011501B2May 18, 2021
Package structure, package-on-package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10861841B2Dec 8, 2020
Semiconductor device with multiple polarity groups
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12406941B2Sep 2, 2025
Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10658348B2May 19, 2020
Semiconductor devices having a plurality of first and second conductive strips
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11842993B2Dec 12, 2023
Semiconductor device with multiple polarity groups
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51