Inventor
JANG YEONHO
KR13 patents
Patents
13 patentsUS11616051B2Mar 28, 2023
Semiconductor package device
SAMSUNG ELECTRONICS CO LTD4 citations74
US11456241B2Sep 27, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US11145611B2Oct 12, 2021
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations72
US12087744B2Sep 10, 2024
Semiconductor package device
SAMSUNG ELECTRONICS CO LTD0 citations62
US11901276B2Feb 13, 2024
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations62
US11869835B2Jan 9, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11637081B2Apr 25, 2023
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11569157B2Jan 31, 2023
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11056461B2Jul 6, 2021
Method of manufacturing fan-out wafer level package
SAMSUNG ELECTRONICS CO LTD1 citations62
US12482721B2Nov 25, 2025
Semiconductor package including heat dissipation structure
SAMSUNG ELECTRONICS CO LTD0 citations58
US12261104B2Mar 25, 2025
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US11791295B2Oct 17, 2023
Semiconductor package with thick under-bump terminal
SAMSUNG ELECTRONICS CO LTD0 citations51
US11094636B2Aug 17, 2021
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations47