Inventor
JANG JAEGWON
KR28 patents
⚠️ This page may combine multiple inventors who share the name “JANG JAEGWON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
26 patentsUS11616051B2Mar 28, 2023
Semiconductor package device
SAMSUNG ELECTRONICS CO LTD4 citations74
US11610785B2Mar 21, 2023
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD4 citations74
US12170251B2Dec 17, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations73
US11869775B2Jan 9, 2024
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD2 citations73
US11810915B2Nov 7, 2023
Semiconductor package with redistribution substrate having embedded passive device
SAMSUNG ELECTRONICS CO LTD2 citations73
US11456241B2Sep 27, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations72
US11145611B2Oct 12, 2021
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD3 citations72
US12453204B2Oct 21, 2025
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US12394700B2Aug 19, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US12300625B2May 13, 2025
Semiconductor package including outer conductive plate
SAMSUNG ELECTRONICS CO LTD0 citations62
US12087744B2Sep 10, 2024
Semiconductor package device
SAMSUNG ELECTRONICS CO LTD0 citations62
US12015018B2Jun 18, 2024
Semiconductor package with multiple redistribution substrates
SAMSUNG ELECTRONICS CO LTD0 citations62
US11901276B2Feb 13, 2024
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD1 citations62
US11869835B2Jan 9, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11804427B2Oct 31, 2023
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations62
US11637081B2Apr 25, 2023
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11569157B2Jan 31, 2023
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11538798B2Dec 27, 2022
Semiconductor package with multiple redistribution substrates
SAMSUNG ELECTRONICS CO LTD0 citations62
US12261106B2Mar 25, 2025
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US9364914B2Jun 14, 2016
Apparatus and method of attaching solder ball and method of fabricating semiconductor package including solder ball
SAMSUNG ELECTRONICS CO LTD0 citations51
US12014975B2Jun 18, 2024
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US11955499B2Apr 9, 2024
Image sensor package including glass substrate and a plurality of redistribution layers disposed below the glass substrate and spaced apart from each other by a predetermined distance
SAMSUNG ELECTRONICS CO LTD0 citations50
US9818703B2Nov 14, 2017
Printed circuit board
SAMSUNG ELECTRONICS CO LTD0 citations48
US11887931B2Jan 30, 2024
Semiconductor package with stepped redistribution structure exposing mold layer
SAMSUNG ELECTRONICS CO LTD0 citations47
US11094636B2Aug 17, 2021
Semiconductor package and method of manufacturing the semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations47
US8922007B2Dec 30, 2014
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations40