Inventor
NAVAJA BRIGHAM
US6 patents
Patents
6 patentsUS12543599B2Feb 3, 2026
Package comprising a first substrate, a second substrate and an electrical device coupled to a bottom surface of the second substrate
QUALCOMM INC1 citations62
US11177223B1Nov 16, 2021
Electromagnetic interference shielding for packages and modules
QUALCOMM INC0 citations60
US11581262B2Feb 14, 2023
Package comprising a die and die side redistribution layers (RDL)
QUALCOMM INC0 citations59
US11552023B2Jan 10, 2023
Passive component embedded in an embedded trace substrate (ETS)
QUALCOMM INC0 citations58
US11948877B2Apr 2, 2024
Hybrid package apparatus and method of fabricating
QUALCOMM INC0 citations50
US10804195B2Oct 13, 2020
High density embedded interconnects in substrate
QUALCOMM INC0 citations49