Inventor

SHIH SHING-YIH

TW164 patents

⚠️ This page may combine multiple inventors who share the name “SHIH SHING-YIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHIH SHING-YIH

NANYA TECHNOLOGY CORP

Method for manufacturing a semiconductor device

Method of making a bit line contact device

Method of manufacturing semiconductor device

Method for preparing a patterned target layer

Trench isolation structure and method of forming the same

Semiconductor device with redistribution structure and method for fabricating the same

Manufacturing method of semiconductor package structure having interconnections between dies

Semiconductor package structure having interconnections between dies and manufacturing method thereof

Semiconductor device with re-fill layer

Semiconductor device with decoupling unit and method for fabricating the same

Method for fabricating semiconductor device with heat dissipation features

Method for fabricating semiconductor device with re-fill layer

Semiconductor device with redistribution structure and method for fabricating the same

Semiconductor device with heat dissipation unit and method for fabricating the same

Semiconductor package structure having stacked die structure

Semiconductor device with protection layers and method for fabricating the same

Semiconductor device structure with bottle-shaped through silicon via and method for forming the same

Semiconductor assembly and method of manufacturing the same

Semiconductor device with protection layers and method for fabricating the same

Semiconductor device and method for fabricating the same

Semiconductor package and manufacturing method thereof

Semiconductor device with interconnect structure and method for preparing the same

Semiconductor device with connecting structure having a step-shaped conductive feature and method for fabricating the same

Semiconductor device with conductive protrusions and method for fabricating the same

Semiconductor assembly and method of manufacturing the same

Semiconductor structure having buffer under bump pad and manufacturing method thereof

Method of forming three dimensional semiconductor structure

MICRON TECHNOLOGY INC

Semiconductor package and fabrication method thereof

Methods of forming microelectronic devices including dummy dice

Wafer level package utilizing molded interposer

Microelectronic package utilizing embedded bridge through-silicon-via interconnect component and related methods

Semiconductor devices including dummy chips

Semiconductor package and fabrication method thereof

Semiconductor package and fabrication method thereof

Microelectronic package structures including redistribution layers

Semiconductor structure having a patterned surface structure and semiconductor chips including such structures

Interposer and semiconductor package

Wafer level package and fabrication method thereof

Semiconductor package with multiple coplanar interposers

Method of fabricating a wafer level package

Wafer level package utilizing molded interposer

Methods of forming microelectronic devices having a patterned surface structure

INOTERA MEMORIES INC

Multi-chip semiconductor package with via components and method for manufacturing the same

Wafer level package and fabrication method thereof

Package-on-package assembly and method for manufacturing the same

Semiconductor package with sidewall-protected RDL interposer and fabrication method thereof

Method for fabricating wafer level package

Wafer level package and fabrication method thereof

Package-on-package assembly and method for manufacturing the same

SHIH SHING-YIH

Method for increasing adhesion between polysilazane and silicon nitride