Inventor
LIANG CHAO HU
TW4 patents
Patents
4 patentsUS7547584B2Jun 16, 2009
Method of reducing charging damage to integrated circuits during semiconductor manufacturing
UNITED MICROELECTRONICS CORP6 citations55
US7176051B2Feb 13, 2007
Method of reducing charging damage to integrated circuits during semiconductor manufacturing
UNITED MICROELECTRONICS CORP4 citations55
US6403443B1Jun 11, 2002
Method for reducing surface humps of doped amorphous silicon layer
UNITED MICROELECTRONICS CORP0 citations41
US7157346B2Jan 2, 2007
Method of reducing charging damage to integrated circuits during semiconductor manufacturing
UNITED MICROELECTRONICS CORP0 citations34