Inventor

HO KWUN-YAO

TW47 patents

⚠️ This page may combine multiple inventors who share the name “HO KWUN-YAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HO KWUN-YAO

VIA TECH INC

Chip package and bump connecting structure thereof

Module board having embedded chips and components and method of forming the same

Electrical connection device

High density laminated substrate structure and manufacture method thereof

Integrated circuit package with a balanced-part structure

Stacked multi-chip package

Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnection

Multi-chip package and manufacturing method thereof

Pattern formation process for an integrated circuit substrate

Module board having embedded chips and components and method of forming the same

Process of forming bonding columns

Flexible electric-contact structure for IC package

Chip package structure

Thin planar heat distributor

Metal post manufacturing method

Method and structure for tape ball grid array package

Structure of a ball-grid array package substrate and processes for producing thereof

Chip package

Multi-conducting through hole structure

Low coefficient of thermal expansion build-up layer packaging and method thereof

High performance thermally enhanced package and method of fabricating the same

Bump process for flip chip package

Chip scale package with heat dissipating part

High density integrated circuit package

Method for high layout density integrated circuit package substrate

Pin grid array integrated circuit connecting device

Circuit board and fabricating process thereof

Vertical routing structure

Electrical connection device between a pin-typed IC package and a circuit board

Process of forming bonding columns

Tab package

Hybrid interconnect substrate and method of manufacture thereof

Chip carrier with oxidation protection layer

Packaging substrate without plating bar and a method of forming the same

High density integrated circuit packages and method for the same

Combination device of the IC connection device and the main board

Electronic assembly

Conductive block mounting process for electrical connection

Method of fabricating circuit substrate

Method for manufacturing multi-layer package substrates

Chip and manufacturing method and application thereof

Manufacturing process of a chip package structure

Lamination process and structure of high layout density substrate

NIDEC CORP

Optical unit

Optical unit

TECO ELECTRIC & MACHINERY CO LTD

Composite two-phase fluid cooling motor and composite two-phase fluid cooling device thereof

KUNG MORISS

Multi-chip package