Inventor
KASULKE PAUL
DE15 patents
⚠️ This page may combine multiple inventors who share the name “KASULKE PAUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PAC TECH GMBH
6 patentsUS6281577B1Aug 28, 2001
Chips arranged in plurality of planes and electrically connected to one another
PAC TECH GMBH350 citations98
US6119919ASep 19, 2000
Method and device for repairing defective soldered joints
PAC TECH GMBH26 citations92
US7087442B2Aug 8, 2006
Process for the formation of a spatial chip arrangement and spatial chip arrangement
PAC TECH GMBH11 citations84
US7829817B2Nov 9, 2010
Device for removing solder material from a soldered joint
PAC TECH GMBH11 citations82
US6056188AMay 2, 2000
Method of attaching a component to a plate-shaped support
PAC TECH GMBH8 citations73
US6328200B1Dec 11, 2001
Process for selective soldering
PAC TECH GMBH3 citations62
FRAUNHOFER GES FORSCHUNG
4 patentsUS6043985AMar 28, 2000
Thermal connecting structure for connecting materials with different expansion coefficients
FRAUNHOFER GES FORSCHUNG21 citations90
US6093971AJul 25, 2000
Chip module with conductor paths on the chip bonding side of a chip carrier
FRAUNHOFER GES FORSCHUNG18 citations84
US6277660B1Aug 21, 2001
Method and apparatus for testing chips
FRAUNHOFER GES FORSCHUNG12 citations72
US6211571B1Apr 3, 2001
Method and apparatus for testing chips
FRAUNHOFER GES FORSCHUNG12 citations72
PAC TEC PACKAGING TECHNOLOGIES
3 patentsUS7121449B2Oct 17, 2006
Method and device for applying material to a workpiece
PAC TEC PACKAGING TECHNOLOGIES13 citations81
US7021517B2Apr 4, 2006
Method and device for applying pieces of material to a workpiece
PAC TEC PACKAGING TECHNOLOGIES8 citations70
US6955284B2Oct 18, 2005
Device for positioning a tool in relation to a workpiece
PAC TEC PACKAGING TECHNOLOGIES7 citations70