P

Inventor

CHUNG JUNG-HEE

KR21 patents
⚠️ This page may combine multiple inventors who share the name “CHUNG JUNG-HEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

20 patents
US7723770B2May 25, 2010

Integrated circuit capacitors having composite dielectric layers therein containing crystallization inhibiting regions

SAMSUNG ELECTRONICS CO LTD15 citations92
US7655519B2Feb 2, 2010

Methods of fabricating metal-insulator-metal capacitors with a chemical barrier layer in a lower electrode

SAMSUNG ELECTRONICS CO LTD9 citations84
US7179739B2Feb 20, 2007

Methods of forming a semiconductor device including a metal silicide layer between a conductive plug and a bottom electrode of a capacitor

SAMSUNG ELECTRONICS CO LTD10 citations84
US7482242B2Jan 27, 2009

Capacitor, method of forming the same, semiconductor device having the capacitor and method of manufacturing the same

SAMSUNG ELECTRONICS CO LTD8 citations83
US7973352B2Jul 5, 2011

Capacitors having composite dielectric layers containing crystallization inhibiting regions

SAMSUNG ELECTRONICS CO LTD4 citations74
US7442604B2Oct 28, 2008

Methods and batch type atomic layer deposition apparatus for forming dielectric films and methods of manufacturing metal-insulator-metal capacitors including the dielectric films

SAMSUNG ELECTRONICS CO LTD8 citations74
US7049232B2May 23, 2006

Methods for forming ruthenium films with β-diketone containing ruthenium complexes and method for manufacturing metal-insulator-metal capacitor using the same

SAMSUNG ELECTRONICS CO LTD8 citations74
US7008837B2Mar 7, 2006

Method of manufacturing capacitor by performing multi-stepped wet treatment on surface of electrode

SAMSUNG ELECTRONICS CO LTD7 citations74
US6849517B2Feb 1, 2005

Methods of forming capacitors including reducing exposed electrodes in semiconductor devices

SAMSUNG ELECTRONICS CO LTD7 citations74
US7205219B2Apr 17, 2007

Methods of forming integrated circuits devices having pad contact plugs in the cell array and peripheral circuit regions of the integrated circuit substrate

SAMSUNG ELECTRONICS CO LTD5 citations73
US9059330B2Jun 16, 2015

Methods of forming integrated circuit capacitors having composite dielectric layers therein containing crystallization inhibiting regions

SAMSUNG ELECTRONICS CO LTD1 citations63
US7700454B2Apr 20, 2010

Methods of forming integrated circuit electrodes and capacitors by wrinkling a layer that includes a high percentage of impurities

SAMSUNG ELECTRONICS CO LTD4 citations63
US7364967B2Apr 29, 2008

Methods of forming storage capacitors for semiconductor devices

SAMSUNG ELECTRONICS CO LTD6 citations63
US7495292B2Feb 24, 2009

Integrated circuit devices having pad contact plugs in the cell array and peripheral circuit regions of the integrated circuit substrate

SAMSUNG ELECTRONICS CO LTD3 citations62
US7422943B2Sep 9, 2008

Semiconductor device capacitors with oxide-nitride layers and methods of fabricating such capacitors

SAMSUNG ELECTRONICS CO LTD3 citations62
US6995071B2Feb 7, 2006

Methods of forming MIM type capacitor structures using low temperature plasma processing

SAMSUNG ELECTRONICS CO LTD6 citations62
US7425761B2Sep 16, 2008

Method of manufacturing a dielectric film in a capacitor

SAMSUNG ELECTRONICS CO LTD6 citations61
US7304367B2Dec 4, 2007

Metal-insulator-metal capacitors including transition metal silicide films on doped polysilicon contact plugs

SAMSUNG ELECTRONICS CO LTD6 citations61
US8344439B2Jan 1, 2013

Integrated circuit capacitors having composite dielectric layers therein containing crystallization inhibiting regions and methods of forming same

SAMSUNG ELECTRONICS CO LTD0 citations52
US7781819B2Aug 24, 2010

Semiconductor devices having a contact plug and fabrication methods thereof

SAMSUNG ELECTRONICS CO LTD1 citations52

CHUNG SEUNG-SIK

1 patent