Inventor
CHUNG JUNG-HEE
KR21 patents
⚠️ This page may combine multiple inventors who share the name “CHUNG JUNG-HEE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
20 patentsUS7723770B2May 25, 2010
Integrated circuit capacitors having composite dielectric layers therein containing crystallization inhibiting regions
SAMSUNG ELECTRONICS CO LTD15 citations92
US7655519B2Feb 2, 2010
Methods of fabricating metal-insulator-metal capacitors with a chemical barrier layer in a lower electrode
SAMSUNG ELECTRONICS CO LTD9 citations84
US7179739B2Feb 20, 2007
Methods of forming a semiconductor device including a metal silicide layer between a conductive plug and a bottom electrode of a capacitor
SAMSUNG ELECTRONICS CO LTD10 citations84
US7482242B2Jan 27, 2009
Capacitor, method of forming the same, semiconductor device having the capacitor and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD8 citations83
US7973352B2Jul 5, 2011
Capacitors having composite dielectric layers containing crystallization inhibiting regions
SAMSUNG ELECTRONICS CO LTD4 citations74
US7442604B2Oct 28, 2008
Methods and batch type atomic layer deposition apparatus for forming dielectric films and methods of manufacturing metal-insulator-metal capacitors including the dielectric films
SAMSUNG ELECTRONICS CO LTD8 citations74
US7049232B2May 23, 2006
Methods for forming ruthenium films with β-diketone containing ruthenium complexes and method for manufacturing metal-insulator-metal capacitor using the same
SAMSUNG ELECTRONICS CO LTD8 citations74
US7008837B2Mar 7, 2006
Method of manufacturing capacitor by performing multi-stepped wet treatment on surface of electrode
SAMSUNG ELECTRONICS CO LTD7 citations74
US6849517B2Feb 1, 2005
Methods of forming capacitors including reducing exposed electrodes in semiconductor devices
SAMSUNG ELECTRONICS CO LTD7 citations74
US7205219B2Apr 17, 2007
Methods of forming integrated circuits devices having pad contact plugs in the cell array and peripheral circuit regions of the integrated circuit substrate
SAMSUNG ELECTRONICS CO LTD5 citations73
US9059330B2Jun 16, 2015
Methods of forming integrated circuit capacitors having composite dielectric layers therein containing crystallization inhibiting regions
SAMSUNG ELECTRONICS CO LTD1 citations63
US7700454B2Apr 20, 2010
Methods of forming integrated circuit electrodes and capacitors by wrinkling a layer that includes a high percentage of impurities
SAMSUNG ELECTRONICS CO LTD4 citations63
US7364967B2Apr 29, 2008
Methods of forming storage capacitors for semiconductor devices
SAMSUNG ELECTRONICS CO LTD6 citations63
US7495292B2Feb 24, 2009
Integrated circuit devices having pad contact plugs in the cell array and peripheral circuit regions of the integrated circuit substrate
SAMSUNG ELECTRONICS CO LTD3 citations62
US7422943B2Sep 9, 2008
Semiconductor device capacitors with oxide-nitride layers and methods of fabricating such capacitors
SAMSUNG ELECTRONICS CO LTD3 citations62
US6995071B2Feb 7, 2006
Methods of forming MIM type capacitor structures using low temperature plasma processing
SAMSUNG ELECTRONICS CO LTD6 citations62
US7425761B2Sep 16, 2008
Method of manufacturing a dielectric film in a capacitor
SAMSUNG ELECTRONICS CO LTD6 citations61
US7304367B2Dec 4, 2007
Metal-insulator-metal capacitors including transition metal silicide films on doped polysilicon contact plugs
SAMSUNG ELECTRONICS CO LTD6 citations61
US8344439B2Jan 1, 2013
Integrated circuit capacitors having composite dielectric layers therein containing crystallization inhibiting regions and methods of forming same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7781819B2Aug 24, 2010
Semiconductor devices having a contact plug and fabrication methods thereof
SAMSUNG ELECTRONICS CO LTD1 citations52