Inventor
MUZZY CHRISTOPHER DAVID
US21 patents
⚠️ This page may combine multiple inventors who share the name “MUZZY CHRISTOPHER DAVID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
17 patentsUS7482675B2Jan 27, 2009
Probing pads in kerf area for wafer testing
IBM40 citations92
US7459785B2Dec 2, 2008
Electrical interconnection structure formation
IBM28 citations92
US7348210B2Mar 25, 2008
Post bump passivation for soft error protection
IBM25 citations92
US8361598B2Jan 29, 2013
Substrate anchor structure and method
IBM8 citations84
US7935408B2May 3, 2011
Substrate anchor structure and method
IBM10 citations84
US7911803B2Mar 22, 2011
Current distribution structure and method
IBM7 citations84
US7859122B2Dec 28, 2010
Final via structures for bond pad-solder ball interconnections
IBM14 citations84
US7462509B2Dec 9, 2008
Dual-sided chip attached modules
IBM10 citations84
US7256503B2Aug 14, 2007
Chip underfill in flip-chip technologies
IBM14 citations84
US7939390B2May 10, 2011
Gap capacitors for monitoring stress in solder balls in flip chip technology
IBM3 citations63
US7777339B2Aug 17, 2010
Semiconductor chips with reduced stress from underfill at edge of chip
IBM4 citations63
US7709876B2May 4, 2010
Gap capacitors for monitoring stress in solder balls in flip chip technology
IBM4 citations63
US7871920B2Jan 18, 2011
Semiconductor chips with reduced stress from underfill at edge of chip
IBM0 citations52
US7862987B2Jan 4, 2011
Method for forming an electrical structure comprising multiple photosensitive materials
IBM1 citations52
US7863734B2Jan 4, 2011
Dual-sided chip attached modules
IBM0 citations52
US7547576B2Jun 16, 2009
Solder wall structure in flip-chip technologies
IBM0 citations52
US8945955B2Feb 3, 2015
Method of changing reflectance or resistance of a region in an optoelectronic memory device
IBM0 citations50
DAUBENSPECK TIMOTHY HARRISON
3 patentsUS8575007B2Nov 5, 2013
Selective electromigration improvement for high current C4s
DAUBENSPECK TIMOTHY HARRISON2 citations60
US9105465B2Aug 11, 2015
Wafer edge conditioning for thinned wafers
DAUBENSPECK TIMOTHY HARRISON0 citations50
US8819933B2Sep 2, 2014
Method for forming a current distribution structure
DAUBENSPECK TIMOTHY HARRISON0 citations50