Inventor
KUBOTA TSUYOSHI
JP36 patents
⚠️ This page may combine multiple inventors who share the name “KUBOTA TSUYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NISCA CORP
8 patentsUS6249303B1Jun 19, 2001
Recording device
NISCA CORP51 citations96
US6679637B2Jan 20, 2004
Printing apparatus and printing method
NISCA CORP20 citations92
US7173643B2Feb 6, 2007
Printing apparatus
NISCA CORP12 citations84
US6668716B2Dec 30, 2003
Printing apparatus
NISCA CORP16 citations83
US6880991B2Apr 19, 2005
Printing method
NISCA CORP11 citations73
USRE40269EApr 29, 2008
Recording device
NISCA CORP4 citations62
US8363076B2Jan 29, 2013
Printing apparatus and printing method
NISCA CORP1 citations52
US7954720B2Jun 7, 2011
Card recording apparatus
NISCA CORP1 citations51
YAMAHA MOTOR CO LTD
7 patentsUS6961997B2Nov 8, 2005
Fracture split method for connecting rod
YAMAHA MOTOR CO LTD21 citations92
US7802493B2Sep 28, 2010
Connecting rod, internal combustion engine, automotive vehicle, and production method for connecting rod
YAMAHA MOTOR CO LTD8 citations84
US7418886B2Sep 2, 2008
Split type connecting rod
YAMAHA MOTOR CO LTD12 citations83
US7299716B2Nov 27, 2007
Split type connecting rod
YAMAHA MOTOR CO LTD13 citations83
US8011271B2Sep 6, 2011
Fracture split-type connecting rod, internal combustion engine, transportation apparatus, and production method for fracture split-type connecting rod
YAMAHA MOTOR CO LTD5 citations63
US7757584B2Jul 20, 2010
Connecting rod and internal combustion engine and automotive vehicle incorporating the same
YAMAHA MOTOR CO LTD4 citations63
US7159559B2Jan 9, 2007
Split connecting rod, engine and vehicle
YAMAHA MOTOR CO LTD6 citations62
SUMCO CORP
4 patentsUS10641708B2May 5, 2020
Method of evaluating semiconductor substrate and method of manufacturing semiconductor substrate
SUMCO CORP3 citations70
US7727783B2Jun 1, 2010
Method of measuring minority carrier diffusion length and method of manufacturing silicon wafer
SUMCO CORP5 citations63
US9935020B2Apr 3, 2018
Method of evaluating metal contamination in boron-doped P-type silicon wafer, device of evaluating metal contamination in boron-doped P-type silicon wafer, and method of manufacturing boron-doped P-type silicon wafer
SUMCO CORP0 citations52
US9842779B2Dec 12, 2017
Method of evaluating metal contamination in semiconductor wafer and method of manufacturing semiconductor wafer
SUMCO CORP1 citations48
HITACHI APPLIANCES INC
3 patentsUS7449227B2Nov 11, 2008
Vacuum insulation panel and refrigerator incorporating the same
HITACHI APPLIANCES INC64 citations94
US7517576B2Apr 14, 2009
Vacuum insulation panel
HITACHI APPLIANCES INC38 citations89
US7361396B2Apr 22, 2008
Vacuum insulating material, refrigerator using vacuum insulating material, vacuum insulating material manufacturing method, and vacuum insulating material manufacturing equipment
HITACHI APPLIANCES INC1 citations45