Inventor
ROTHWELL MARY B
US15 patents
⚠️ This page may combine multiple inventors who share the name “ROTHWELL MARY B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
12 patentsUS9524470B1Dec 20, 2016
Modular array of vertically integrated superconducting qubit devices for scalable quantum computing
IBM51 citations97
US9953269B2Apr 24, 2018
Modular array of vertically integrated superconducting qubit devices for scalable quantum computing
IBM13 citations92
US10304005B2May 28, 2019
Modular array of vertically integrated superconducting qubit devices for scalable quantum computing
IBM5 citations84
US10304004B2May 28, 2019
Modular array of vertically integrated superconducting qubit devices for scalable quantum computing
IBM3 citations84
US10170680B2Jan 1, 2019
Qubits by selective laser-modulated deposition
IBM11 citations84
US10169714B2Jan 1, 2019
Modular array of vertically integrated superconducting qubit devices for scalable quantum computing
IBM5 citations84
US7566632B1Jul 28, 2009
Lock and key structure for three-dimensional chip connection and process thereof
IBM19 citations84
US7608538B2Oct 27, 2009
Formation of vertical devices by electroplating
IBM7 citations74
US10727391B2Jul 28, 2020
Bump bonded cryogenic chip carrier
IBM2 citations73
US10289960B2May 14, 2019
Modular array of vertically integrated superconducting qubit devices for scalable quantum computing
IBM2 citations73
US7695897B2Apr 13, 2010
Structures and methods for low-k or ultra low-k interlayer dielectric pattern transfer
IBM6 citations62
US10734567B2Aug 4, 2020
Bump bonded cryogenic chip carrier
IBM0 citations52