Inventor
DIEP BUU
US11 patents
⚠️ This page may combine multiple inventors who share the name “DIEP BUU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RAYTHEON CO
6 patentsUS8736045B1May 27, 2014
Integrated bondline spacers for wafer level packaged circuit devices
RAYTHEON CO8 citations82
US9196556B2Nov 24, 2015
Getter structure and method for forming such structure
RAYTHEON CO0 citations50
US9187312B2Nov 17, 2015
Integrated bondline spacers for wafer level packaged circuit devices
RAYTHEON CO0 citations50
US9174836B2Nov 3, 2015
Integrated bondline spacers for wafer level packaged circuit devices
RAYTHEON CO0 citations50
US9073298B2Jul 7, 2015
Disposable bond gap control structures
RAYTHEON CO0 citations48
US9105800B2Aug 11, 2015
Method of forming deposited patterns on a surface
RAYTHEON CO0 citations39
DIEP BUU
4 patentsUS8454789B2Jun 4, 2013
Disposable bond gap control structures
DIEP BUU6 citations82
US8844793B2Sep 30, 2014
Reducing formation of oxide on solder
DIEP BUU4 citations71
US8980676B2Mar 17, 2015
Fabrication of window cavity cap structures in wafer level packaging
DIEP BUU2 citations60
US8393526B2Mar 12, 2013
System and method for packaging electronic devices
DIEP BUU2 citations59