Inventor
GOIDA THOMAS M
US22 patents
⚠️ This page may combine multiple inventors who share the name “GOIDA THOMAS M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ANALOG DEVICES INC
10 patentsUS5084753AJan 28, 1992
Packaging for multiple chips on a single leadframe
ANALOG DEVICES INC55 citations90
US9343367B2May 17, 2016
Integrated device die and package with stress reduction features
ANALOG DEVICES INC11 citations83
US9209121B2Dec 8, 2015
Double-sided package
ANALOG DEVICES INC8 citations83
US7939916B2May 10, 2011
Wafer level CSP packaging concept
ANALOG DEVICES INC19 citations82
US9698127B2Jul 4, 2017
Integrated device die and package with stress reduction features
ANALOG DEVICES INC3 citations72
US10287161B2May 14, 2019
Stress isolation features for stacked dies
ANALOG DEVICES INC3 citations65
US10800651B2Oct 13, 2020
Low stress integrated device packages
ANALOG DEVICES INC1 citations62
US7829379B2Nov 9, 2010
Wafer level stacked die packaging
ANALOG DEVICES INC3 citations62
US11702335B2Jul 18, 2023
Low stress integrated device package
ANALOG DEVICES INC0 citations55
US9533878B2Jan 3, 2017
Low stress compact device packages
ANALOG DEVICES INC0 citations35
INVENSENSE INC
5 patentsUS9162872B2Oct 20, 2015
Pre-molded MEMS device package having conductive column coupled to leadframe and cover
INVENSENSE INC4 citations83
US8941223B2Jan 27, 2015
MEMS device package with conductive shell
INVENSENSE INC2 citations62
US9079760B2Jul 14, 2015
Integrated microphone package
INVENSENSE INC3 citations54
US9258634B2Feb 9, 2016
Microphone system with offset apertures
INVENSENSE INC1 citations52
US9573800B2Feb 21, 2017
Pre-molded MEMS device package having conductive column coupled to leadframe and cover
INVENSENSE INC0 citations51