Inventor

PAI YU CHENG

TW22 patents

⚠️ This page may combine multiple inventors who share the name “PAI YU CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PAI YU CHENG

SILICONWARE PRECISION INDUSTRIES CO LTD

Package structure and fabrication method thereof

Method for fabricating electronic package

Carrier structure and package structure

Method of fabricating semiconductor package structure

Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same

Semiconductor package structure and method of fabricating the same

Method of fabricating package structure with an embedded electronic component

Method of manufacturing package substrate and semiconductor package

Fabrication method of coreless packaging substrate

Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the same

Package structure with an embedded electronic component and method of fabricating the package structure

Package structure having a laminated release layer and method for fabricating the same

Package substrate, semiconductor package and method of manufacturing the same

Electronic package structure and fabrication method thereof

Coreless packaging substrate and fabrication method thereof

Fabrication method of semiconductor package

Electronic package and method for fabricating the same

Fabrication method of package structure

Method of fabricating a packaging substrate including a carrier having two carrying portions

Electronic package and substrate structure thereof

HUNG LIANG-YI

Semiconductor package and fabrication method thereof

HSIAO WEI CHUNG

Semiconductor package and fabrication method thereof