Inventor · disambiguated record
Ming-Chen Sun
Also filed as: SUN MING · SUN MING-CHEN
17 granted patents·13 pending applications·19 citations·filing 2001–2018
89Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD24HUNG LIANG-YI2UNIV ALABAMA2HSIAO WEI-CHUNG1UNIV TSINGHUA1
Top patents by PatentIndex Score
30 records- 0171US7453200B2White-light organic light-emitting diode (OLED) and its fabrication methodUNIV TSINGHUA·Filed 2006·Granted Nov 18, 2008·11 cites·10 claims
- 0269US10141266B2Method of fabricating semiconductor package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Nov 27, 2018·1 cites·20 claims
- 0368US9490225B2Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 8, 2016·2 cites·20 claims
- 0463US9716060B2Package structure with an embedded electronic component and method of fabricating the package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jul 25, 2017·1 cites·12 claims
- 0560US9673140B2Package structure having a laminated release layer and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Jun 6, 2017·1 cites·9 claims
- 0660US8796867B2Semiconductor package and fabrication method thereofHSIAO WEI CHUNG·Filed 2012·Granted Aug 5, 2014·1 cites·10 claims
- 0759US8471383B2Semiconductor package and fabrication method thereofHUNG LIANG-YI·Filed 2011·Granted Jun 25, 2013·2 cites·16 claims
- 0857US9510463B2Coreless packaging substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 29, 2016·0 cites·9 claims
- 0953US9112063B2Fabrication method of semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Aug 18, 2015·0 cites·13 claims
- 1052US10068842B2Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Sep 4, 2018·0 cites·13 claims
- 1152US10002825B2Method of fabricating package structure with an embedded electronic componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Jun 19, 2018·0 cites·23 claims
- 1252US2016013123A1Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 1351US9899249B2Fabrication method of coreless packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2016·Granted Feb 20, 2018·0 cites·10 claims
- 1451US2005201176A1Method for the preparation of nanometer scale particle arrays and the particle arrays prepared therebyUNIV ALABAMA·Filed 2005·Application pending·0 cites
- 1550US9735080B2Single-layer wiring package substrate, single-layer wiring package structure having the package substrate, and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Aug 15, 2017·0 cites·8 claims
- 1649US10043757B2Semiconductor package structure and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Aug 7, 2018·0 cites·10 claims
- 1749US9905438B2Method of manufacturing package substrate and semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Granted Feb 27, 2018·0 cites·13 claims
- 1849US9640503B2Package substrate, semiconductor package and method of manufacturing the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted May 2, 2017·0 cites·17 claims
- 1949US2018247891A1Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Application pending·0 cites
- 2048US2017301658A1Fabrication method of package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 2148US2014057410A1Method of fabricating a packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Application pending·0 cites
- 2246US10096491B2Method of fabricating a packaging substrate including a carrier having two carrying portionsSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Oct 9, 2018·0 cites·5 claims
- 2344US2015325516A1Coreless packaging substrate, pop structure, and methods for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 2444US2015333029A1Package substrate and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 2543US2016071780A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
- 2642US2015102484A1Package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 2740US2002145826A1Method for the preparation of nanometer scale particle arrays and the particle arrays prepared therebyUNIV ALABAMA·Filed 2001·Application pending·0 cites
- 2839US2013026657A1Semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2011·Application pending·0 cites
- 2934US2013228921A1Substrate structure and fabrication method thereofHUNG LIANG-YI·Filed 2012·Application pending·0 cites
- 3033US2016086879A1Package substrate and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →