Inventor

SAKAI TADAHIKO

JP57 patents

⚠️ This page may combine multiple inventors who share the name “SAKAI TADAHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAKAI TADAHIKO

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Method of forming solder bumps on electrodes of electronic component

Method for forming bump electrode

Method of transferring conductive balls onto work piece

Apparatus and method for mounting electrically conductive balls

Conductive ball mounting apparatus and mounting method of conductive ball

Method of transferring conductive balls

Semiconductor device, method of manufacturing the device and method of mounting the device

Method of mounting bumped electronic components

Method of forming solder bump and method of mounting the same

Method of soldering bumped work by partially penetrating the oxide film covering the solder bumps

Electronic parts mounting method

Mounting structure of electronic component having bumps

Structure of electronic parts and method of soldering electronic parts to substrate

Apparatus and method of transferring conductive balls and apparatus and method of supplying conductive balls

Method of soldering electronic part using a bond for tacking the electronic part

Printed circuit board

Semiconductor device and method for assembling the same

Method of securely mounting conductive balls

Method for mounting conductive balls on a substrate

Electronic device mounting method

Printed circuit board

Method of manufacturing semiconductor device

Semiconductor device and semiconductor device assembly

Mounting method of bump-equipped electronic component and mounting structure of the same

Semiconductor device and resin binder for assembling semiconductor device

Bond for tacking an electronic part

PANASONIC CORP

Electronic component mounting method and electronic component mounting device

Electronic component mounting method

Method of mounting electronic components

Method for soldering electronic component and soldering structure of electronic component

Components joining method and components joining structure

Electric components connecting method

Method of soldering electronic component having solder bumps to substrate

Electronic components mounting adhesive and electronic components mounting structure

Method for manufacturing electronic parts module

Electronic component mounting method

Method of bonding core wires to electrodes and electronic unit formed by bonding electrodes and core wires

PANASONIC IP MAN CO LTD

Component-mounted structure

Mounting board manufacturing method and flux coating device

Electronic component-mounted structure, IC card and COF package

Adhesive for provisionally fixing electronic component to solder precoat and method for producing electronic component mounted substrate

Connection structure of circuit member, connection method, and connection material

Method for producing electronic component mounted substrate

MOTOMURA KOJI

Electronic component mounting system and electronic component mounting method

Electronic element unit and reinforcing adhesive agent

MAEDA TADASHI

Flux for soldering and soldering process

Paste for soldering and soldering method using the same

SAKAI TADAHIKO

Connecting method of electronic component

Components joining method and components joining structure

OZONO MITSURU

Electronic component soldering structure and electronic component soldering method