Inventor
NA DUK JU
SG10 patents
⚠️ This page may combine multiple inventors who share the name “NA DUK JU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
7 patentsUS9184104B1Nov 10, 2015
Semiconductor device and method of forming adhesive layer over insulating layer for bonding carrier to mixed surfaces of semiconductor die and encapsulant
STATS CHIPPAC LTD17 citations81
US10115701B2Oct 30, 2018
Semiconductor device and method of forming conductive vias by backside via reveal with CMP
STATS CHIPPAC LTD4 citations68
US9076655B2Jul 7, 2015
Semiconductor device and method of forming through-silicon-via with sacrificial layer
STATS CHIPPAC LTD2 citations54
US9768066B2Sep 19, 2017
Semiconductor device and method of forming conductive vias by direct via reveal with organic passivation
STATS CHIPPAC LTD0 citations50
US9257382B2Feb 9, 2016
Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer
STATS CHIPPAC LTD0 citations48
US9728415B2Aug 8, 2017
Semiconductor device and method of wafer thinning involving edge trimming and CMP
STATS CHIPPAC LTD1 citations46
US9865524B2Jan 9, 2018
Semiconductor device and method of forming conductive vias using backside via reveal and selective passivation
STATS CHIPPAC LTD0 citations39