Inventor

YONG CHANG BEOM

SG5 patents

⚠️ This page may combine multiple inventors who share the name “YONG CHANG BEOM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

4 patents

US9076655B2Jul 7, 2015

Semiconductor device and method of forming through-silicon-via with sacrificial layer

STATS CHIPPAC LTD2 citations54

US9601462B2Mar 21, 2017

Semiconductor device and method of forming UBM structure on back surface of TSV semiconductor wafer

STATS CHIPPAC LTD0 citations50

US9257382B2Feb 9, 2016

Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer

STATS CHIPPAC LTD0 citations48

US9865524B2Jan 9, 2018

Semiconductor device and method of forming conductive vias using backside via reveal and selective passivation

STATS CHIPPAC LTD0 citations39

NA DUK JU

1 patent

US8558389B2Oct 15, 2013

Semiconductor device and method of forming guard ring around conductive TSV through semiconductor wafer

NA DUK JU5 citations75