Inventor

XIAO REN-WEI

TW5 patents

⚠️ This page may combine multiple inventors who share the name “XIAO REN-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

4 patents

US9530690B2Dec 27, 2016

Metal pad structure over TSV to reduce shorting of upper metal layer

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations59

US10050103B2Aug 14, 2018

Method of forming semiconductor structures including metal insulator metal capacitor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50

US9984971B2May 29, 2018

Methods of forming metal pad structures over TSVS to reduce shorting of upper metal layers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50

US9666660B2May 30, 2017

Semiconductor structures including metal insulator metal capacitor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50

TAIWAN SEMICONDUCTOR MFG

1 patent

US9177914B2Nov 3, 2015

Metal pad structure over TSV to reduce shorting of upper metal layer

TAIWAN SEMICONDUCTOR MFG5 citations80