Inventor
PAQUET MARIE-CLAUDE
CA17 patents
⚠️ This page may combine multiple inventors who share the name “PAQUET MARIE-CLAUDE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
10 patentsUS9698072B2Jul 4, 2017
Low-stress dual underfill packaging
IBM8 citations83
US9373559B2Jun 21, 2016
Low-stress dual underfill packaging
IBM3 citations72
US10368441B2Jul 30, 2019
Method and apparatus for strain relieving surface mount attached connectors
IBM1 citations71
US10338325B1Jul 2, 2019
Nanofiller in an optical interface
IBM2 citations71
US9627784B1Apr 18, 2017
Method and apparatus for strain relieving surface mount attached connectors
IBM2 citations71
US6988882B2Jan 24, 2006
Transfer molding of integrated circuit packages
IBM7 citations70
US6956296B2Oct 18, 2005
Transfer molding of integrated circuit packages
IBM9 citations70
US6656773B2Dec 2, 2003
Transfer molding of integrated circuit packages
IBM9 citations70
US10750615B2Aug 18, 2020
Method and apparatus for strain relieving surface mount attached connectors
IBM0 citations50
US9974179B2May 15, 2018
Method and apparatus for strain relieving surface mount attached connectors
IBM0 citations50