Inventor
TRAN SON K
US24 patents
⚠️ This page may combine multiple inventors who share the name “TRAN SON K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
22 patentsUS6100114AAug 8, 2000
Encapsulation of solder bumps and solder connections
IBM54 citations96
US6074895AJun 13, 2000
Method of forming a flip chip assembly
IBM63 citations95
US6596559B2Jul 22, 2003
Flip-chip package with optimized encapsulant adhesion and method
IBM17 citations92
US6348738B1Feb 19, 2002
Flip chip assembly
IBM17 citations92
US6306683B1Oct 23, 2001
Method of forming a flip chip assembly, and a flip chip assembly formed by the method
IBM16 citations92
US6246124B1Jun 12, 2001
Encapsulated chip module and method of making same
IBM30 citations92
US6739497B2May 25, 2004
SMT passive device noflow underfill methodology and structure
IBM31 citations91
US7119003B2Oct 10, 2006
Extension of fatigue life for C4 solder ball to chip connection
IBM14 citations80
US6713858B2Mar 30, 2004
Flip-chip package with optimized encapsulant adhesion and method
IBM5 citations73
US6558981B2May 6, 2003
Method for making an encapsulated semiconductor chip module
IBM7 citations73
US6248614B1Jun 19, 2001
Flip-chip package with optimized encapsulant adhesion and method
IBM9 citations73
US7408264B2Aug 5, 2008
SMT passive device noflow underfill methodology and structure
IBM5 citations72
US7109592B2Sep 19, 2006
SMT passive device noflow underfill methodology and structure
IBM8 citations72
US6617698B2Sep 9, 2003
Reworkable and thermally conductive adhesive and use thereof
IBM11 citations72
US10368441B2Jul 30, 2019
Method and apparatus for strain relieving surface mount attached connectors
IBM1 citations71
US9627784B1Apr 18, 2017
Method and apparatus for strain relieving surface mount attached connectors
IBM2 citations71
US10014273B2Jul 3, 2018
Fixture to constrain laminate and method of assembly
IBM1 citations61
US6777817B2Aug 17, 2004
Reworkable and thermally conductive adhesive and use thereof
IBM2 citations61
US9455234B2Sep 27, 2016
Fixture to constrain laminate and method of assembly
IBM0 citations51
US10750615B2Aug 18, 2020
Method and apparatus for strain relieving surface mount attached connectors
IBM0 citations50
US9974179B2May 15, 2018
Method and apparatus for strain relieving surface mount attached connectors
IBM0 citations50
US7067916B2Jun 27, 2006
Extension of fatigue life for C4 solder ball to chip connection
IBM0 citations48