Inventor

FALCON JAVIER A

US17 patents

⚠️ This page may combine multiple inventors who share the name “FALCON JAVIER A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FALCON JAVIER A

INTEL CORP

Quantum computing assemblies with through-hole dies

Quantum computing assemblies

Shielded interconnects

Quantum circuit assemblies with on-chip demultiplexers

Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric

Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package

Package substrates with top superconductor layers for qubit devices

Ultra small molded module integrated with die by module-on-wafer assembly

Ultra small molded module integrated with die by module-on-wafer assembly

Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric

Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric

Space-efficient underfilling techniques for electronic assemblies

Qubit die attachment using preforms

TSV-less die stacking using plated pillars/through mold interconnect

Ultra small molded module integrated with die by module-on-wafer assembly

Semiconductor packaging with high density interconnects

TAHOE RES LTD

Semiconductor packaging with high density interconnects