Inventor
TAN SAMANTHA S H
US33 patents
⚠️ This page may combine multiple inventors who share the name “TAN SAMANTHA S H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
22 patentsUS9257638B2Feb 9, 2016
Method to etch non-volatile metal materials
LAM RES CORP55 citations97
US9130158B1Sep 8, 2015
Method to etch non-volatile metal materials
LAM RES CORP44 citations97
US11322351B2May 3, 2022
Tin oxide films in semiconductor device manufacturing
LAM RES CORP15 citations94
US11988965B2May 21, 2024
Underlayer for photoresist adhesion and dose reduction
LAM RES CORP13 citations93
US11551938B2Jan 10, 2023
Alternating etch and passivation process
LAM RES CORP13 citations93
US11314168B2Apr 26, 2022
Underlayer for photoresist adhesion and dose reduction
LAM RES CORP24 citations93
US12094711B2Sep 17, 2024
Tin oxide films in semiconductor device manufacturing
LAM RES CORP5 citations86
US12278125B2Apr 15, 2025
Integrated dry processes for patterning radiation photoresist patterning
LAM RES CORP8 citations85
US12183604B2Dec 31, 2024
Integrated dry processes for patterning radiation photoresist patterning
LAM RES CORP9 citations84
US11848212B2Dec 19, 2023
Alternating etch and passivation process
LAM RES CORP10 citations84
US12437995B2Oct 7, 2025
Tin oxide films in semiconductor device manufacturing
LAM RES CORP1 citations75
US12417916B2Sep 16, 2025
Tin oxide films in semiconductor device manufacturing
LAM RES CORP1 citations75
US12504692B2Dec 23, 2025
Cyclic development of metal oxide based photoresist for etch stop deterrence
LAM RES CORP2 citations74
US12474638B2Nov 18, 2025
Underlayer for photoresist adhesion and dose reduction
LAM RES CORP2 citations74
US12183589B2Dec 31, 2024
Tin oxide mandrels in patterning
LAM RES CORP3 citations74
US12293919B2May 6, 2025
Alternating etch and passivation process
LAM RES CORP3 citations73
US12062538B2Aug 13, 2024
Atomic layer etch and selective deposition process for extreme ultraviolet lithography resist improvement
LAM RES CORP3 citations73
US9391267B2Jul 12, 2016
Method to etch non-volatile metal materials
LAM RES CORP3 citations72
US12474640B2Nov 18, 2025
Integration of dry development and etch processes for EUV patterning in a single process chamber
LAM RES CORP4 citations71
US12315727B2May 27, 2025
Eliminating yield impact of stochastics in lithography
LAM RES CORP0 citations62
US12131909B2Oct 29, 2024
Selective processing with etch residue-based inhibitors
LAM RES CORP0 citations61
US12435412B2Oct 7, 2025
High density, modulus, and hardness amorphous carbon films at low pressure
LAM RES CORP0 citations44
APPLIED MATERIALS INC
3 patentsUS7754609B1Jul 13, 2010
Cleaning processes for silicon carbide materials
APPLIED MATERIALS INC11 citations84
US7452475B2Nov 18, 2008
Cleaning process and apparatus for silicate materials
APPLIED MATERIALS INC6 citations74
US7789969B2Sep 7, 2010
Methods and apparatus for cleaning chamber components
APPLIED MATERIALS INC6 citations56