Inventor
HIGASHI TOSHIFUMI
JP8 patents
Patents
8 patentsUS11784459B2Oct 10, 2023
Electrical element mounting package, array package, and electrical device
KYOCERA CORP5 citations72
US6953756B2Oct 11, 2005
Glass ceramic sintered body and wiring board using the sintered body
KYOCERA CORP11 citations71
US11972992B2Apr 30, 2024
Substrate for mounting an electronic component, electrical device, and light-emitting device
KYOCERA CORP0 citations60
US11778747B2Oct 3, 2023
Wiring board, composite substrate, and electric device
KYOCERA CORP0 citations60
US12598700B2Apr 7, 2026
Wiring board
KYOCERA CORP0 citations59
US11362484B2Jun 14, 2022
Light-emitting-element housing member, array member, and light emitting device
KYOCERA CORP0 citations59
US11530794B2Dec 20, 2022
Lighting device for a vehicle and vehicle
KYOCERA CORP0 citations50
US11978998B2May 7, 2024
Substrate for mounting a light-emitting element, array substrate, and light-emitting device
KYOCERA CORP0 citations48