Inventor
KATAOKA FUMIO
JP20 patents
⚠️ This page may combine multiple inventors who share the name “KATAOKA FUMIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
16 patentsUS5388328AFeb 14, 1995
Process for fabricating an interconnected multilayer board
HITACHI LTD69 citations95
US5300735AApr 5, 1994
Interconnected multilayer boards and fabrication processes thereof
HITACHI LTD42 citations95
US4748228AMay 31, 1988
Process for producing organic silicon-terminated polyimide precursor and polyimide
HITACHI LTD55 citations94
US5536584AJul 16, 1996
Polyimide precursor, polyimide and metalization structure using said polyimide
HITACHI LTD37 citations92
US5272247ADec 21, 1993
Polyimide precursor, cured product thereof, and processes for producing them
HITACHI LTD30 citations92
US4513132AApr 23, 1985
Heat-resistant silicone block polymer
HITACHI LTD43 citations92
US4451551AMay 29, 1984
Radiation-sensitive poly(amic acid) polymer composition
HITACHI LTD43 citations90
US4554237ANov 19, 1985
Photosensitive resin composition and method for forming fine patterns with said composition
HITACHI LTD22 citations82
US4565767AJan 21, 1986
Light-sensitive polymer composition with poly(amic acid), bisazide, and tertiary amine compound
HITACHI LTD24 citations81
US4727185AFeb 23, 1988
Process for preparation of 3,3',4,4'-biphenyltetracarboxylic acid salts
HITACHI LTD12 citations74
US6087006AJul 11, 2000
Surface-protecting film and resin-sealed semiconductor device having said film
HITACHI LTD10 citations73
US5399758AMar 21, 1995
Diacylhydrazine photo-reactive compounds
HITACHI LTD15 citations71
US5851681ADec 22, 1998
Wiring structure with metal wiring layers and polyimide layers, and fabrication process of multilayer wiring board
HITACHI LTD8 citations70
US4587197AMay 6, 1986
Flexible photosensitive polymer composition with azide and/or amine compound, poly(amic acid) and highly polar compound with boiling point above 150° C.
HITACHI LTD11 citations70
US5753372AMay 19, 1998
Wiring structures and method of manufacturing the same
HITACHI LTD3 citations59
US6200831B1Mar 13, 2001
Surface-protecting film and resin-sealed semiconductor device having said film
HITACHI LTD1 citations51