Inventor
FITZGERALD THOMAS J
US27 patents
⚠️ This page may combine multiple inventors who share the name “FITZGERALD THOMAS J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
20 patentsUS6848172B2Feb 1, 2005
Device and method for package warp compensation in an integrated heat spreader
INTEL CORP41 citations96
US6504242B1Jan 7, 2003
Electronic assembly having a wetting layer on a thermally conductive heat spreader
INTEL CORP128 citations96
US6504723B1Jan 7, 2003
Electronic assembly having solder thermal interface between a die substrate and a heat spreader
INTEL CORP56 citations96
US6751099B2Jun 15, 2004
Coated heat spreaders
INTEL CORP47 citations95
US7527090B2May 5, 2009
Heat dissipating device with preselected designed interface for thermal interface materials
INTEL CORP24 citations92
US7362580B2Apr 22, 2008
Electronic assembly having an indium wetting layer on a thermally conductive body
INTEL CORP41 citations92
US7102226B2Sep 5, 2006
Device and method for package warp compensation in an integrated heat spreader
INTEL CORP18 citations92
US7239517B2Jul 3, 2007
Integrated heat spreader and method for using
INTEL CORP25 citations91
US7672132B2Mar 2, 2010
Electronic packaging apparatus and method
INTEL CORP21 citations89
US7364063B2Apr 29, 2008
Thermally coupling an integrated heat spreader to a heat sink base
INTEL CORP23 citations88
US6817091B2Nov 16, 2004
Electronic assembly having solder thermal interface between a die substrate and a heat spreader
INTEL CORP13 citations84
US9330999B2May 3, 2016
Multi-component integrated heat spreader for multi-chip packages
INTEL CORP7 citations79
US7256058B2Aug 14, 2007
Device and method for package warp compensation in an integrated heat spreader
INTEL CORP6 citations74
US7081669B2Jul 25, 2006
Device and system for heat spreader with controlled thermal expansion
INTEL CORP10 citations74
US7219421B2May 22, 2007
Method of a coating heat spreader
INTEL CORP9 citations72
US7160758B2Jan 9, 2007
Electronic packaging apparatus and method
INTEL CORP7 citations70
US7996989B2Aug 16, 2011
Heat dissipating device with preselected designed interface for thermal interface materials
INTEL CORP4 citations63
US7553702B2Jun 30, 2009
Integrating a heat spreader with an interface material having reduced void size
INTEL CORP2 citations61
US10236233B2Mar 19, 2019
Heat spreaders with integrated preforms
INTEL CORP0 citations50
US9799584B2Oct 24, 2017
Heat spreaders with integrated preforms
INTEL CORP0 citations50