Inventor
RENAVIKAR MUKUL P
US10 patents
⚠️ This page may combine multiple inventors who share the name “RENAVIKAR MUKUL P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
8 patentsUS7239517B2Jul 3, 2007
Integrated heat spreader and method for using
INTEL CORP25 citations91
US7183641B2Feb 27, 2007
Integrated heat spreader with intermetallic layer and method for making
INTEL CORP15 citations82
US7553702B2Jun 30, 2009
Integrating a heat spreader with an interface material having reduced void size
INTEL CORP2 citations61
US7485495B2Feb 3, 2009
Integrated heat spreader with intermetallic layer and method for making
INTEL CORP5 citations60
US9394619B2Jul 19, 2016
Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby
INTEL CORP0 citations51
US7087521B2Aug 8, 2006
Forming an intermediate layer in interconnect joints and structures formed thereby
INTEL CORP0 citations51
US7205595B2Apr 17, 2007
Polymer memory device with electron traps
INTEL CORP1 citations50
US10049971B2Aug 14, 2018
Package structure to enhance yield of TMI interconnections
INTEL CORP0 citations48