Inventor
JADHAV SUSHEEL G
US9 patents
⚠️ This page may combine multiple inventors who share the name “JADHAV SUSHEEL G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
8 patentsUS7955900B2Jun 7, 2011
Coated thermal interface in integrated circuit die
INTEL CORP20 citations91
US7239517B2Jul 3, 2007
Integrated heat spreader and method for using
INTEL CORP25 citations91
US7164585B2Jan 16, 2007
Thermal interface apparatus, systems, and methods
INTEL CORP11 citations83
US7183641B2Feb 27, 2007
Integrated heat spreader with intermetallic layer and method for making
INTEL CORP15 citations82
US7220622B2May 22, 2007
Method for attaching a semiconductor die to a substrate and heat spreader
INTEL CORP9 citations73
US7553702B2Jun 30, 2009
Integrating a heat spreader with an interface material having reduced void size
INTEL CORP2 citations61
US11715928B2Aug 1, 2023
Decoupling layer to reduce underfill stress in semiconductor devices
INTEL CORP1 citations60
US7485495B2Feb 3, 2009
Integrated heat spreader with intermetallic layer and method for making
INTEL CORP5 citations60