Inventor
CLEVENGER LARRY
US13 patents
⚠️ This page may combine multiple inventors who share the name “CLEVENGER LARRY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
8 patentsUS6420216B1Jul 16, 2002
Fuse processing using dielectric planarization pillars
IBM331 citations99
US7365001B2Apr 29, 2008
Interconnect structures and methods of making thereof
IBM35 citations92
US6057236AMay 2, 2000
CVD/PVD method of filling structures using discontinuous CVD AL liner
IBM17 citations83
US7091612B2Aug 15, 2006
Dual damascene structure and method
IBM8 citations73
US7125792B2Oct 24, 2006
Dual damascene structure and method
IBM8 citations72
US6661097B1Dec 9, 2003
Ti liner for copper interconnect with low-k dielectric
IBM7 citations72
US6890815B2May 10, 2005
Reduced cap layer erosion for borderless contacts
IBM5 citations61
US6361880B1Mar 26, 2002
CVD/PVD/CVD/PVD fill process
IBM6 citations61
INFINEON TECHNOLOGIES AG
2 patentsUS7241696B2Jul 10, 2007
Method for depositing a metal layer on a semiconductor interconnect structure having a capping layer
INFINEON TECHNOLOGIES AG20 citations92
US6281114B1Aug 28, 2001
Planarization after metal chemical mechanical polishing in semiconductor wafer fabrication
INFINEON TECHNOLOGIES AG9 citations70