Inventor
KALDOR STEFFEN K
US11 patents
⚠️ This page may combine multiple inventors who share the name “KALDOR STEFFEN K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
8 patentsUS6975032B2Dec 13, 2005
Copper recess process with application to selective capping and electroless plating
IBM85 citations97
US7098537B2Aug 29, 2006
Interconnect structure diffusion barrier with high nitrogen content
IBM17 citations92
US7064064B2Jun 20, 2006
Copper recess process with application to selective capping and electroless plating
IBM22 citations92
US7052621B2May 30, 2006
Bilayered metal hardmasks for use in Dual Damascene etch schemes
IBM15 citations92
US7241681B2Jul 10, 2007
Bilayered metal hardmasks for use in dual damascene etch schemes
IBM13 citations83
US7214548B2May 8, 2007
Apparatus and method for flattening a warped substrate
IBM18 citations79
US7378338B2May 27, 2008
Method of forming an interconnect structure diffusion barrier with high nitrogen content
IBM2 citations63
US7494915B2Feb 24, 2009
Back end interconnect with a shaped interface
IBM0 citations52
INFINEON TECHNOLOGIES AG
3 patentsUS7241696B2Jul 10, 2007
Method for depositing a metal layer on a semiconductor interconnect structure having a capping layer
INFINEON TECHNOLOGIES AG20 citations92
US7122462B2Oct 17, 2006
Back end interconnect with a shaped interface
INFINEON TECHNOLOGIES AG25 citations92
US7001835B2Feb 21, 2006
Crystallographic modification of hard mask properties
INFINEON TECHNOLOGIES AG0 citations52