Inventor

SHIKA KOUJI

JP2 patents

Patents

2 patents

US5288698AFeb 22, 1994

Method of positioning lead frame on molding die to seal semiconductor element with resin

MITSUBISHI ELECTRIC CORP50 citations94

US5123823AJun 23, 1992

Molding device for sealing semiconductor element with resin

MITSUBISHI ELECTRIC CORP31 citations90