Inventor

LEE HSIN-HUI

TW57 patents

⚠️ This page may combine multiple inventors who share the name “LEE HSIN-HUI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE HSIN-HUI

TAIWAN SEMICONDUCTOR MFG

Reducing cracking of high-lead or lead-free bumps by matching sizes of contact pads and bump pads

Method for dicing semiconductor wafers

Method of making a wafer level chip scale package

Method for improving bump reliability for flip chip devices

Seal ring structure with a metal pad

Thermally enhanced wafer level package

IC chip package structure and underfill process

Structures and methods for heat dissipation of semiconductor integrated circuits

Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling

Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw blade

Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling

Method of measuring photoresist and bump misalignment

Method to improve reliability for flip-chip device for limiting pad design

Fluxless bumping process using ions

Scribe line layout design

Method of forming a solder ball using a thermally stable resinous protective layer

DFR laminating and film removing system

Thermally enhanced wafer level package

Underfilling efficiency by modifying the substrate design of flip chips

Application of impressed-current cathodic protection to prevent metal corrosion and oxidation

Fluxless bumping process

Packaged semiconductor chip comprising an integrated circuit chip ablated with laser and cut with saw blade from wafer

Method of manufacturing low CTE substrates for use with low-k flip-chip package devices

Underfilling efficiency by modifying the substrate design of flip chips

Fluxless bumping process

Application of impressed-current cathodic protection to prevent metal corrosion and oxidation

Ferris wheel-like stripping or cleaning mechanism for semiconductor fabrication

Encapsulation method for SBGA

Structure of wafer level chip molded package

Low CTE substrates for use with low-k flip-chip package devices

Microelectronics package assembly tool and method of manufacture therewith

Stencil design for solder paste printing

Multi-project wafer and method of making same

VANGUARD INT SEMICONDUCT CORP

Optical sensor structure and method for forming the same

Optical sensor and manufacturing method thereof

Semiconductor device and fingerprint identification device

Optical sensor and method for forming the same

Semiconductor devices and methods for forming the same

Semiconductor device and method for forming the same

Semiconductor devices and methods for forming the same

Semiconductor devices and methods for forming the same

Optical sensors and methods for forming the same

Optical sensor and method for forming the same

Optical sensor device with reduced thickness and method for forming the same

Semiconductor devices and methods for forming the same

LIN JENG-SHYAN

Seal ring structure with metal pad

LEE HSIN-HUI

Structure and method of wafer level chip molded packaging

CHEN YEN-MING

Method to improve bump reliability for flip chip device

LII MIRNG-JI

Semiconductor package structures

TAIWAN SEMICONDUCTOR MFG CO LTD

Seal ring structure with a metal pad