Inventor
NARENDRNATH KADTHALA R
US26 patents
⚠️ This page may combine multiple inventors who share the name “NARENDRNATH KADTHALA R”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
23 patentsUS6280584B1Aug 28, 2001
Compliant bond structure for joining ceramic to metal
APPLIED MATERIALS INC167 citations99
US6108189AAug 22, 2000
Electrostatic chuck having improved gas conduits
APPLIED MATERIALS INC255 citations99
US6721162B2Apr 13, 2004
Electrostatic chuck having composite dielectric layer and method of manufacture
APPLIED MATERIALS INC76 citations98
US6481886B1Nov 19, 2002
Apparatus for measuring pedestal and substrate temperature in a semiconductor wafer processing system
APPLIED MATERIALS INC92 citations98
US6310755B1Oct 30, 2001
Electrostatic chuck having gas cavity and method
APPLIED MATERIALS INC325 citations98
US6538872B1Mar 25, 2003
Electrostatic chuck having heater and method
APPLIED MATERIALS INC123 citations97
US6490146B2Dec 3, 2002
Electrostatic chuck bonded to base with a bond layer and method
APPLIED MATERIALS INC88 citations97
US6581275B2Jun 24, 2003
Fabricating an electrostatic chuck having plasma resistant gas conduits
APPLIED MATERIALS INC74 citations96
US6490144B1Dec 3, 2002
Support for supporting a substrate in a process chamber
APPLIED MATERIALS INC57 citations96
US6462928B1Oct 8, 2002
Electrostatic chuck having improved electrical connector and method
APPLIED MATERIALS INC65 citations96
US6440221B2Aug 27, 2002
Process chamber having improved temperature control
APPLIED MATERIALS INC93 citations96
US6414834B1Jul 2, 2002
Dielectric covered electrostatic chuck
APPLIED MATERIALS INC56 citations96
US6220607B1Apr 24, 2001
Thermally conductive conformal media
APPLIED MATERIALS INC30 citations92
US9716012B2Jul 25, 2017
Methods of selective layer deposition
APPLIED MATERIALS INC15 citations84
US9613846B2Apr 4, 2017
Pad design for electrostatic chuck surface
APPLIED MATERIALS INC5 citations71
US10177014B2Jan 8, 2019
Thermal radiation barrier for substrate processing chamber components
APPLIED MATERIALS INC2 citations70
US11569069B2Jan 31, 2023
3D printed chamber components configured for lower film stress and lower operating temperature
APPLIED MATERIALS INC0 citations61
US10553473B2Feb 4, 2020
Edge ring for a substrate processing chamber
APPLIED MATERIALS INC1 citations61
US10636690B2Apr 28, 2020
Laminated top plate of a workpiece carrier in micromechanical and semiconductor processing
APPLIED MATERIALS INC0 citations52
US6913670B2Jul 5, 2005
Substrate support having barrier capable of detecting fluid leakage
APPLIED MATERIALS INC0 citations51
US10777391B2Sep 15, 2020
3D printed chamber components configured for lower film stress and lower operating temperature
APPLIED MATERIALS INC0 citations50
US10005025B2Jun 26, 2018
Corrosion resistant abatement system
APPLIED MATERIALS INC0 citations47
US10399202B2Sep 3, 2019
Retaining ring for lower wafer defects
APPLIED MATERIALS INC0 citations41
NARENDRNATH KADTHALA R
2 patentsUS8225927B2Jul 24, 2012
Method to substantially enhance shelf life of hygroscopic components and to improve nano-manufacturing process tool availablity
NARENDRNATH KADTHALA R9 citations82
US8464594B2Jun 18, 2013
Measuring flow properties of multiple gas nozzles of a gas distributor
NARENDRNATH KADTHALA R8 citations81