Inventor
NEO SIEW
US15 patents
⚠️ This page may combine multiple inventors who share the name “NEO SIEW”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
APPLIED MATERIALS INC
7 patentsUS6899804B2May 31, 2005
Electrolyte composition and treatment for electrolytic chemical mechanical polishing
APPLIED MATERIALS INC77 citations98
US6776693B2Aug 17, 2004
Method and apparatus for face-up substrate polishing
APPLIED MATERIALS INC101 citations98
US6863797B2Mar 8, 2005
Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP
APPLIED MATERIALS INC45 citations96
US6837983B2Jan 4, 2005
Endpoint detection for electro chemical mechanical polishing and electropolishing processes
APPLIED MATERIALS INC32 citations92
US6991526B2Jan 31, 2006
Control of removal profile in electrochemically assisted CMP
APPLIED MATERIALS INC14 citations84
US7384534B2Jun 10, 2008
Electrolyte with good planarization capability, high removal rate and smooth surface finish for electrochemically controlled copper CMP
APPLIED MATERIALS INC2 citations63
US7678245B2Mar 16, 2010
Method and apparatus for electrochemical mechanical processing
APPLIED MATERIALS INC0 citations52
LAM RES CORP
5 patentsUS10573522B2Feb 25, 2020
Method for preventing line bending during metal fill process
LAM RES CORP38 citations96
US11355345B2Jun 7, 2022
Method for preventing line bending during metal fill process
LAM RES CORP21 citations93
US12362188B2Jul 15, 2025
Method for preventing line bending during metal fill process
LAM RES CORP2 citations73
US10214807B2Feb 26, 2019
Atomic layer deposition of tungsten for enhanced fill and reduced substrate attack
LAM RES CORP3 citations71
US11225712B2Jan 18, 2022
Atomic layer deposition of tungsten for enhanced fill and reduced substrate attack
LAM RES CORP0 citations60